电子封装用纳米复合焊膏的研究进展  

Research Progress of Composite Nanosolders for Electronic Packaging

作　　者：杜伟 强军锋[1] 余竹焕[1] 高炜 阎亚雯 王晓慧 刘旭亮 DU Wei;QIANG Junfeng;YU Zhuhuan;GAO Wei;YAN Yawen;WANG Xiaohui;LIU Xuliang(College of Materials Science and Engineering,Xi’an University of Science and Technology,Xi’an 710054,China)

机构地区：[1]西安科技大学材料科学与工程学院,西安710054

出　　处：《材料导报》2023年第19期158-168,共11页Materials Reports

基　　金：西安科技大学优秀青年科技基金项目(2018YQ2-12);凝固技术国家重点实验室开放课题(SKLSP201846);陕西省留学人员科技活动择优资助项目(201847)。

摘　　要：焊料作为焊接工艺的核心,在电子封装器件与材料的互连中扮演着重要角色。随着第三代功率半导体器件的发展,迫使电子封装材料向高功率密度、高服役温度和高可靠性的方向发展。纳米复合焊膏凭借其低温烧结、高温服役和优越的导电性能成为未来电子封装互连材料领域重要的研究方向。本文综合阐述了纳米复合焊膏的研究进展,重点介绍了目前纳米复合焊膏的三种制备方法;归纳整理了Sn-Ag-Cu、Sn-Cu、Ag-Cu、Sn-Zn和Sn-Ag几种不同类型的纳米复合焊膏,并总结了焊膏微观组织、熔化特性、润湿性、导电性、力学性能和可靠性的影响机理;指出了目前纳米复合焊膏的不足之处,并对其发展趋势以及研究前景进行了分析和展望,以期能够为日后研发更高性能的纳米复合焊膏提供一定的理论参考。As the key of the welding process,solders play an important role in the interconnection between electronic packaging devices and materials.The electronic packaging materials are forced to develop in the direction of high power density,high service temperature and high reliability as the demands of new generation power devices increase.Composite nanosolders have shown good prospects due to their low-temperature sintering,high-temperature service,and excellent electrical conductivity.In this paper,a review of current research on composite nanosolders is presented.Characteristics between the three methods used to prepare composite nanosolders are first discussed.Thereafter,the effective mec-hanism of composite nanosolders on the microstructure and properties are discussed for Sn-Ag-Cu,Sn-Cu,Ag-Cu,Sn-Zn,and Sn-Ag composite nanosolders.Finally,the limitations and developmental research trends of composite nanosolders are summarized as a reference for the future investigation of composite nanosolders with improved performance.

关 键 词：纳米复合焊膏 电化学沉积法 微乳法 液相化学还原法 显微组织 可靠性 

分 类 号：TG42[金属学及工艺—焊接]