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作 者:石磊 罗浩[2] 罗瑞盈[2] Shi Lei;Luo Hao;Luo Rui-ying(Shanghai Hangyi Research Institute of High-tech Development Co.,Ltd.,Shanghai 200433,China;Research Institute for Frontier Science,Beihang University,Beijing 100191,China)
机构地区:[1]上海航翼高新技术发展研究院有限公司,上海200433 [2]北京航空航天大学前沿科学技术创新研究院,北京100191
出 处:《炭素技术》2023年第4期22-26,共5页Carbon Techniques
摘 要:采用耐高温粘接剂对C/C复合材料进行粘接,粘接剂的粘接厚度分别为175,260,355,445μm,通过对粘接C/C复合材料剪切强度测试和SEM分析,研究了胶层厚度对C/C复合材料剪切粘接性能的影响规律。结果表明,胶层厚度为175μm时剪切粘接强度为13.22 MPa,胶层结构均匀致密,无孔隙缺陷,胶层厚度增加至445μm时剪切粘接强度为10.82 MPa,降低了18.15%。通过SEM对不同厚度胶层微观结构分析表明,胶层厚度为175μm的粘接剂微观结构均匀致密,没有孔洞、裂纹等缺陷。胶层厚度增加至445μm后,粘接剂中出现直径约250μm的凹坑、直径约100~200μm的大孔以及直径约5~50μm的小孔,剪切粘接强度降低18.15%。分析其原因为胶层厚度增加,固化和炭化过程中胶层内部的气泡含量逐渐增多,体积收缩概率增大,孔隙等缺陷形成,而孔隙的形成会导致材料的有效承载面积减小,引起应力集中,粘接强度降低。In this paper,C/C composites were bonded with high temperature resistant adhesive,and the adhesive layers with the thickness of 175,260,355,445μm were prepared respectively.The influence of adhesive layer thickness on the shear bonding properties of C/C composites was studied by testing shear strength of C/C composites and SEM.The results showed that the adhesive layer thickness is 175μm,the shear bonding strength is 13.22 MPa and the structure of the adhesive layer is uniform and dense without pore defects.The thickness of adhesive layer is 445μm,the shear bonding strength is 10.82 MPa,decreases by 18.15%.The microstructure analysis of adhesive layer with different thickness by SEM showed that the thickness of adhesive layer is 175μm with uniform and dense without defects such as holes and cracks.When the adhesive layer thickness increases to 445μm,the adhesive grow pits with a diameter of about 250μm,large holes with a diameter of about 100-200μm and small holes with a diameter of about 5-50μm,and the shear bonding strength decreases by 18.15%.With the thickness of the adhesive layer increasing,there are increased bubble content in the adhesive layer increases during curing and carbonization,and volume shrinkage and pores.The formation of pores would reduce the effective bearing area of the material,causing stress concentration and reducing the bonding strength.
关 键 词:C/C复合材料 胶层厚度 粘接剂 剪切强度 裂纹
分 类 号:TB332[一般工业技术—材料科学与工程]
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