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作 者:Eunhwan Jo Hojoon Lee Jae-Ik Lee Jongbaeg Kim
机构地区:[1]School of Mechanical Engineering,Yonsei University,50 Yonsei-ro,Seodaemun-gu,Seoul 03722,Republic of Korea [2]Department of Neurosurgery,Massachusetts General Hospital,Harvard Medical School,25 Shattuck St,Boston,MA 02115,USA
出 处:《Microsystems & Nanoengineering》2023年第3期73-81,共9页微系统与纳米工程(英文)
基 金:This work was supported by the National Research Foundation of Korea(NRF)grant funded by the Korean government(MSIT)(No.2021R1A2B5B03002850).
摘 要:Microelectromechanical systems(MEMS)are of considerable interest due to their compact size and low power consumption when used in modern electronics.MEMS devices intrinsically incorporate three-dimensional(3D)microstructures for their intended operations;however,these microstructures are easily broken by mechanical shocks accompanying high-magnitude transient acceleration,inducing device malfunction.Although various structural designs and materials have been proposed to overcome this limit,developing a shock absorber for easy integration into existing MEMS structures that effectively dissipates impact energy remains challenging.Here,a vertically aligned 3D nanocomposite based on ceramic-reinforced carbon nanotube(CNT)arrays is presented for in-plane shock-absorbing and energy dissipation around MEMS devices.This geometrically aligned composite consists of regionally-selective integrated CNT arrays and a subsequent atomically thick alumina layer coating,which serve as structural and reinforcing materials,respectively.The nanocomposite is integrated with the microstructure through a batch-fabrication process and remarkably improves the in-plane shock reliability of a designed movable structure over a wide acceleration range(0-12,000g).In addition,the enhanced shock reliability through the nanocomposite was experimentally verified through comparison with various control devices.
分 类 号:TB383[一般工业技术—材料科学与工程]
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