弹载综合电子系统及其关键技术发展分析  

Analysis of the Development and Key Technologies of Missile-borne Integrated Avionics System

作　　者：石大山 葛宇航 孟光韦 季飚 蔡克荣 SHI Dashan;GE Yuhang;MENG Guangwei;JI Biao;CAI Kerong(Shanghai Electro-Mechanical Engineering Institute,Shanghai 201109,China)

机构地区：[1]上海机电工程研究所,上海201109

出　　处：《空天防御》2023年第3期52-57,共6页Air & Space Defense

基　　金：装备预先研究共用技术(50902020202)。

摘　　要：弹载综合电子系统是弹上电子电气设备的发展方向,可以有效地提高导弹电子设备的集成化、模块化和小型化水平,同时降低成本。本文首先介绍了综合电子系统的概念和组成,以及综合电子研究的意义;然后,综述了国内外综合电子系统发展现状,并阐述了弹载综合电子系统发展趋势和高速串行总线技术、分时分区操作系统技术、微系统技术等关键技术;最后,分析总结了综合电子系统的挑战和未来的发展趋势。The missile-borne integrated avionics system determines the development of the electronic and electrical equipment of the missile.It can effectively improve integration,modularization,and miniaturization while reducing costs.This paper first introduced the concept and system composition of an integrated avionics system.Then,it summarized the development status domestically and abroad and expounded on the development trend and key technologies of missile-brone integrated avionics systems,including high-speed serial bus,time-sharing partition operating systems,and microsystem.Finally,the existing challenges and future development trends were summarized.

关 键 词：弹载综合电子系统 高速总线 操作系统 微系统 人工智能 导弹 

分 类 号：V274.1[航空宇航科学与技术—飞行器设计]