新型热隔离高频信号传输结构  

New thermal isolation high frequency signal transmission structure

作　　者：廖翱[1,2] 唐彬浛 张童童 吕晓萌 景飞 LIAO Ao;TANG Binhan;ZHANG Tongtong;LYU Xiaomeng;JING Fei(The 29th Research Institute of CETC,Chengdu 610036,China;Sichuan Province Engineering Research Center for Broadband Microwave Circuit High Density Integration,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036 [2]四川省宽带微波电路高密度集成工程研究中心,成都610036

出　　处：《光通信技术》2023年第5期50-52,共3页Optical Communication Technology

摘　　要：为了保持直调电/光转换组件激光器恒温区域温度不变,提出了一种新型的热隔离高频信号传输结构。该结构采用低热导率介质的电容来传输高频信号,有效增大了电/光转换组件中射频和激光器芯片之间的传热热阻,降低了从射频到激光器芯片恒温区之间的热传导。仿真结果表明:与传统的电路片搭接结构、金丝级联结构相比,所提传输结构使半导体制冷器的热负载分别降低了20.5%、10%,电流分别降低了100、60 mA;同时,该传输结构在2~18 GHz频段内的回波损耗最大只有-16.7 dB,具备良好的射频传输性能。In order to maintain the constant temperature of the constant temperature region of the directly tuned electrical/optical conversion module laser,a new type of thermal isolation high-frequency signal transmission structure is proposed.This structure uses a capacitor of a low thermal conductivity medium to transmit high-frequency signals,increasing the heat transfer resistance between the radio frequency and the laser chip in the electrical/optical conversion module effectively,and reducing the heat conduction from the radio frequency to the constant temperature region of the laser chip.The simulation results show that compared with traditional circuit chip overlap structure and gold wire cascade structure,the proposed transmission structure reduces the thermal load of the semiconductor cooler by 20.5%and 10%respectively,and reduces the current by 100 mAand 60 mA respectively.At the same time,the maximum return loss of this transmission structure in the frequency range of 2~18 GHz is only-16.7 dB,which has good radio frequency transmission performance.

关 键 词：热隔离 电容 低热导率 电/光转换组件 半导体制冷器 回波损耗 

分 类 号：TN929.1[电子电信—通信与信息系统]