一种降低直调电/光转换组件功耗的封装方法  

Packaging method for reducing power consumption of directly modulated electrical/optical conversion module

作　　者：笪余生 唐彬浛 张童童 景飞 吕晓萌 廖翱[1,2] DA Yusheng;TANG Binhan;ZHANG Tongtong;JING Fei;LYU Xiaomeng;LIAO Ao(The 29th Research Institute of CETC,Chengdu 610036,China;Sichuan Province Engineering Research Center for Broadband Microwave Circuit High Density Integration,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036 [2]四川省宽带微波电路高密度集成工程研究中心,成都610036

出　　处：《光通信技术》2023年第5期63-66,共4页Optical Communication Technology

摘　　要：为了降低直调电/光转换组件的功耗,以对组件的散热分析结论为基础,提出一种降低直调电/光转换组件功耗的封装方法,即对组件变形敏感的区域采用传统的柯伐合金材料,对半导体制冷器(TEC)底部要求快速散热的区域则采用热导率较高的金刚石铜材料。仿真与测试结果表明:所提出的方法可以降低TEC热端面与组件底面之间的温差、TEC的冷热两端面温差、TEC的电流和TEC自身产生的功耗;在工作温度为70℃时,电/光转换组件的单通道功耗从传统封装方式的2.875 W降低到1.25 W,功耗降低了56.5%。In order to reduce the power consumption of the directly modulated electrical/optical conversion module,based on the analysis of the heat dissipation of the module,a packaging method is proposed to reduce the power consumption of the directly modulated electrical/optical conversion module.The traditional Kovar alloy material is used in the area sensitive to module deformation,and the diamond copper material with high thermal conductivity is used in the area requiring fast heat dissipation at the bottom of the semiconductor cooler(TEC).The simulation and test results show that the proposed method can reduce the temperature difference between the hot TEC end face and the bottom of the component,the temperature difference between the cold and hot TEC ends,the current of TEC and the power consumption generated by TEC itself.At the operating temperature of 70℃,the single-channel power consumption of the electrical/optical conversion module is reduced from 2.875 W in the traditional package to 1.25 W,which is a 56.5%reduction in power consumption.

关 键 词：电/光转换组件 半导体制冷器 金刚石铜 功耗 

分 类 号：TN929.1[电子电信—通信与信息系统]