晶界界面匹配表征方法及其在晶界工程中的应用  

Grain boundary inter⁃connection characterization and its application in grain boundary engineering

作　　者：王卫国 WANG Wei-guo(School of Materials Science and Engineering,Fujian University of Technology,Fuzhou Fujian 350118,China)

机构地区：[1]福建理工大学材料科学与工程学院,福建福州350118

出　　处：《电子显微学报》2023年第4期526-542,共17页Journal of Chinese Electron Microscopy Society

基　　金：国家自然科学基金资助项目(Nos.51971063,5227027).

摘　　要：晶界界面匹配是指相邻两个晶粒终止于其晶界平面处的晶体学晶面之间的匹配。晶界界面匹配决定着晶界的位错结构、自由体积、原子键合状态和小面化行为等,是晶界结构的本征参量。本文重点介绍了基于电子背散射衍射和体视学的晶界界面匹配表征方法,主要包括晶界重构和晶界提取、晶界过滤、五参数晶界面取向分布统计以及晶界界面匹配定性和定量表征等,总结了近年来晶界界面匹配表征方法在高层错能面心立方金属、体心立方金属以及六方WC/Co硬质合金和Si3N4先进陶瓷材料晶界工程研究中的应用,强调了晶界界面匹配表征方法的普遍适用性及其在材料的基于晶界结构与特性的创新性组织设计和性能优化研究领域的潜在价值。Grain boundary inter⁃connection(GBIC)is the matching of two crystal planes from two abutting grains terminated at the grain boundary in polycrystalline materials.GBIC is an intrinsic parameter describing the character of grain boundary.It determines the dislocation structure,free volume,bonding state and faceting behavior in grain boundary regions.In current paper,the method of GBIC characterization based on electron backscatter diffraction(EBSD)and stereology is presented.It includes after⁃EBSD grain boundary reconstruction and extraction,grain boundary partitioning or filtration,grain boundary plane distribution statistics using five parameter analysis(FPA),qualitative and quantitative GBIC characterization.Then,the application of GBIC characterization in the grain boundary engineering(GBE)is summarized,the involved materials are high stacking fault energy face⁃centered cubic metals,body⁃centered cubic metals and the hexagonal WC/Co cemented carbide and Si3N4 advanced ceramic.Finally,it stresses the universality and highlights the potential value of GBIC characterization in the innovative microstructure design and performance upgrade for some key engineering materials based on grain boundary structures and properties.

关 键 词：晶界 晶界界面匹配 电子背散射衍射 晶界特征分布 晶界工程 

分 类 号：O763[理学—晶体学] O766.1