相变材料与热管耦合的电子器件热管理研究进展  

A review of coupling PCM modules with heat pipes for electronic thermal management

作　　者：吴延鹏 刘乾隆 田东民 陈凤君 WU Yanpeng;LIU Qianlong;TIAN Dongmin;CHEN Fengjun(School of Civil and Resources Engineering,University of Science and Technology Beijing,Beijing 100083,China;Beijing Zhongchuang Green System Technology Co.,Ltd.,Beijing 100024,China)

机构地区：[1]北京科技大学土木与资源工程学院,北京100083 [2]北京中创绿色系统科技有限公司,北京100024

出　　处：《化工学报》2023年第S01期25-31,共7页CIESC Journal

基　　金：北京市自然科学基金项目(8202034)。

摘　　要：电子器件的小型化带来了高热通量和温度分布不均的问题,热管与相变材料(PCM)耦合将热管的高热导率与PCM的高潜热结合,更好地控制热管蒸发段温度,保证电子器件内部温度场稳定均匀,有效提高电子器件的散热能力,降低冷却系统的能耗。综述了热管与PCM耦合的电子器件热管理的研究进展,介绍了热管与PCM的耦合方式以及强化PCM与热管耦合传热的方法,提出了该耦合模块存在的问题以及可能的解决途径。The miniaturization of electronic devices creates problems of high heat flux and uneven temperature distribution.The coupling of heat pipe and phase change material(PCM)combines the high thermal conductivity of heat pipe with the high latent heat of PCM,so as to better control the temperature in the evaporation section of heat pipe,ensure the stability and uniformity of the internal temperature field of electronic devices,effectively improve the heat dissipation capacity of electronic devices,and reduce the energy consumption of cooling system.In this paper,the research progress of thermal management of electronic devices coupled with heat pipe and PCM is reviewed,the coupling mode of heat pipe and PCM and the coupling heat transfer method of PCM and heat pipe are introduced,and the existing problems and possible solutions of the coupling module are put forward.

关 键 词：热管 相变材料 电子冷却 节能 储能 

分 类 号：TK124[动力工程及工程热物理—工程热物理]