高性能有机硅导热垫片的制备与性能表征  

Preparation and Characterization of High-Performance Silicone Thermal Pad

作　　者：万炜涛 王红玉 郭呈毅 彭庆元 陈田安 WAN Weitao;WANG Hongyu;GUO Chengyi;PENG Qingyuan;CHEN Tianan(Shenzhen Darbond Interface Material Co.,Ltd.,Shenzhen 518100,China)

机构地区：[1]深圳德邦界面材料有限公司,广东深圳518100

出　　处：《有机硅材料》2023年第5期9-13,共5页Silicone Material

基　　金：深圳市高导热半导体热界面材料工程研究中心项目(2109-440307-04-01-417434)。

摘　　要：以双组分加成型硅凝胶为主要原料,氧化铝为导热填料,添加硅烷偶联剂、铂催化剂等制得有机硅导热垫片,研究了其基本性能、微观形貌、渗油量、挥发性和返修性能。结果表明,有机硅导热垫片外观平整光滑、无掉粉,热导率为5.0 W/(m·K),邵氏OO硬度为50,密度为3.2 g/cm^(3),击穿电压为9 kV/mm,体积电阻为1×10^(13)Ω;125℃放置7 d时渗油量为1.377%;150℃放置24 h后玻璃管底、管壁透明无异物;于120℃放置8 h拆卸后导热垫片完整地保留在单块铝板表面,垫片表面无破损,返修性能良好;有机硅导热垫片中,粒径较大与较小的球型氧化铝在基体中互相连接并通过氧化锌搭桥形成了完善的导热通路。The silicone thermal conductive pad was prepared with two-component additional silicone gel as main materials,alumina,silane coupling agent and platinum catalyst were added.The basic property,micro morphology,oil bleeding and volatility and rework performance of the thermal pad were studied.The results show that the thermal pad has smooth surface with no powder,with a thermal conductivity of 5.0 W/(m·K),Shore OO hardness of 50,density of 3.2 g/cm^(3),breakdown voltage of 9.0 kV/mm,volume resistance of 1×10^(13)Ω,oil bleeding of 1.377%at 125℃for 7 days.The wall of the glass tube was tested at 150℃for 24 hours,and no other matter was found at the bottom.Its surface remained intact and undamaged after 120℃for 8 hours,and the larger spherical alumina has been interconnected with the smaller one,forming a thermal conductivity path by zinc oxide.

关 键 词：导热垫片 有机硅 热导率 渗油 返修 

分 类 号：TQ433[化学工程]