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作 者:朱洪涛 李红强[1] 吴向荣 赖学军[1] 曾幸荣[1] 任碧野[1] 程宪涛 刘洪 ZHU Hongtao;LI Hongqiang;WU Xiangrong;LAI Xuejun;ZENG Xingrong;REN Biye;CHENG Xiantao;LIU Hong(School of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China;Guangdong Haoming Organic Silicon Materials Co.,Ltd.,Zhaoqing 526000,China)
机构地区:[1]华南理工大学材料科学与工程学院,广州510640 [2]广东皓明有机硅材料有限公司,广东肇庆526000
出 处:《有机硅材料》2023年第5期70-77,共8页Silicone Material
基 金:肇庆市第四批西江创新团队项目。
摘 要:有机硅材料虽然具有优良的耐高低温性、电气绝缘性、耐候性、憎水性、耐腐蚀性等,但其导热性差,难以满足航空航天、电子电气、高频通信等领域对设备高性能化和小型化的需求。近年来,利用各种导热填料改性有机硅材料以赋予其导热性已成为研究热点之一。本文介绍了有机硅材料的导热机理,重点综述了近年来导热硅脂和导热硅橡胶的研究进展,并展望了其发展方向。Silicone materials have excellent high/low temperature resistance,electrical insulation,weather resistance,hydrophobicity and corrosion resistance,while their thermal conductivity is poor,making them difficult to meet the needs of high-performance and miniaturization of equipment in aerospace,electronics and electrical,high-frequency communication and other fields.In recent years,the silicone materials with various thermal conductive fillers have become the research focus.In this review,the thermally conductive mechanism was introduced,and the research progress of thermal conductive silicone grease and silicone rubber were summarized in details,and the future prospects were reviewed.
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