复杂环境下一种综合模块化航空电子机架的散热设计  

Heat Dissipation Design of an Integrated Modular Avionics Equipment in Complex Environment

作　　者：杨德春[1] YANG De-chun(Southwest China Institute of Electronic Technology,Chengdu 610036)

机构地区：[1]中国电子科技集团公司第十研究所,成都610036

出　　处：《环境技术》2023年第8期12-19,共8页Environmental Technology

摘　　要：本文研究了一种综合模块化航空电子机架,对比了不同的散热方案,采用模块直接风冷的散热方案,能够满足散热要求和电磁兼容及环境适应性等复杂环境要求,经过热设计理论计算、仿真分析和实验验证,结果表明该方案合理可行。In this paper,an integrated modular avionics equipmentis studied,and different heat dissipation schemes are compared.The modular direct cooling scheme can meet the dissipation requirements and the complex environments such as electromagnetic compatibility and environment adaptability.After thermal design theory calculation,simulation analysis and experimental verification,the results show that the scheme is reasonable and feasible.

关 键 词：综合模块化航空电子机架 强迫风冷 热计算与仿真 复杂环境 

分 类 号：TN305.94[电子电信—物理电子学]