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作 者:周鹏伟 刘涛[1] 刘瑜 王珂 许均江 马祯[1] ZHOU Peng-wei;LIU Tao;LIU Yu;WANG Ke;XU Jun-jiang;MA Zhen(Shanghai Institute of Space Power-sources,Shanghai 200245)
出 处:《环境技术》2023年第8期25-30,35,共7页Environmental Technology
摘 要:D04硅橡胶常用于航天产品元器件的加固操作,可实现增强产品的抗力学环境作用,但目前针对元器件点胶粘固的必要性以及规范性多以型号沿用为主,而不同型号产品的应用状态存在差异。本研究工作以直插钝化玻璃二极管BWA66为研究对象,通过ANSYS软件对不同D04硅橡胶点涂高度在力、热环境下进行界面应力模拟仿真和定性分析,深入探讨了该类封装元器件使用硅橡胶粘固的必要性以及对D04硅橡胶点胶粘固工艺参数进行了确认。D04 silicone rubber is widely used in the aerospace products,which can enhance the resistance of the product components against the mechanical environmental effects.However,the necessity and standardization of the components mainly rely on the applied experiences of products,therefore it is common that the application status and the requirements of some standards and specifications are different.In this study,the thorough-hole diode BWA66 was chosen as the research object,and the interface stress simulation and qualitative analysis were carried out on different D04 silicone rubber spot coating heights under the mechanical and thermal environment by ANSYS software.The necessity of using silicone rubber to bond the components was deeply discussed,and the bonding process parameters of D04 silicone rubber were confirmed.
分 类 号:O21[理学—概率论与数理统计]
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