高热密度板卡模块高效散热设计研究  

Research on Efficient Heat Dissipation Design of High Heat Density Board Card Module

作　　者：史亮 赵静 王瑞豪 周颖 满天乐 SHI Liang;ZHAO Jing;WANG Rui-hao;ZHOU Ying;MAN Tian-le(China Electronics Technology Group Corporation No 52 Research Institute,Hangzhou 31l121)

机构地区：[1]中国电子科技集团公司第五十二研究所,杭州311121

出　　处：《环境技术》2023年第8期68-73,共6页Environmental Technology

摘　　要：随着信息化与电子技术不断突破创新,电子板卡模块功耗升高,呈现高热密度特点,带来的高温环境对板卡模块的稳定性造成了较大的影响,其散热问题逐渐凸显。本文利用导热块、热管和散热冷板构建高效散热路径,实现均衡热量分布并高效散热的设计目的,采用FLOTHERM软件建立热仿真模型,确定板卡模块在典型功耗和最大功耗工况下的强迫风冷环境的风速要求,可为同类型高热密度板卡模块散热设计提供参考。The power consumption of card module has increased,presenting high thermal density characteristics.The high temperature environment brought about has had a significant impact on the stability of card modules,and its heat dissipation problem has gradually become prominent.This article constructs an efficient heat dissipation path,achieving the design goal of balanced heat distribution and efficient heat dissipation.FLoTHERM software is used to establish a thermal simulation model and determine the wind speed requirements.This has strong reference significance for the heat dissipation design of the same type of high heat density board module.

关 键 词：高热密度 板卡模块 散热设计 传导散热 热仿真 

分 类 号：TN927[电子电信—通信与信息系统]