蔗糖-脱酚棉籽蛋白胶黏剂的合成与固化过程分析  

Investigation of synthesis and curing process of sucrose-dephenolized cottonseed protein adhesive

作　　者：林秋沐 蔡雯倩 赵中元 LIN Qiumu;CAI Wenqian;ZHAO Zhongyuan(College of Furnishings and Industrial Design,Nanjing Forestry University,Nanjing 210037,China)

机构地区：[1]南京林业大学家居与工业设计学院,南京210037

出　　处：《林业工程学报》2023年第5期93-100,共8页Journal of Forestry Engineering

基　　金：江苏省研究生实践创新计划(SJCX21_0339)。

摘　　要：以改善蔗糖基胶黏剂透胶问题和提升其胶合性能为目的,采用脱酚棉籽蛋白(DCP)作为交联剂,制备了一种木材用环保胶黏剂(蔗糖-脱酚棉籽蛋白(SADP-DCP)胶黏剂)。探索了胶黏剂的最佳制备条件,并分析了其热固化行为和固化过程。在制备条件方面,围绕胶黏剂的固含量、DCP和SADP的质量比、合成温度和时间展开试验研究,明确SADP-DCP胶黏剂在固含量为50%、DCP与SADP质量比为1∶3、合成温度为70℃、合成时间为3 h时为最佳。使用最佳条件制得的胶黏剂(SADP-DCP-H3)所制胶合板无透胶现象,湿剪切强度为0.98 MPa,超出GB/T 9846—2015《普通胶合板》(≥0.7 MPa)的40%。在热固化行为研究方面,SADP-DCP-H3胶黏剂在170℃加热7 min时不溶解率达到60%,热分析结果显示,其在158℃附近时发生吸热反应,并伴随质量的快速损失。采用全反射红外光谱(ATR FT-IR)分析研究了SADP-DCP-H3胶黏剂的固化机理,结果显示,胶黏剂固化物中含有呋喃类物质,形成了以二甲基醚桥(—C—O—C—)为主要连接键的聚合物。微观形貌分析表明,添加DCP后的胶黏剂能够形成更加致密的交联结构。To improve the bleed-through phenomenon and optimize the bonding performance of sucrose-based adhesive,this study employed dephenolized cottonseed protein(DCP)as the crosslinking agent to develop an eco-friendly wood adhesive,being referred to dephenolized cottonseed protein-sucrose(SADP-DCP)adhesive.To determine the optimal preparation conditions for the SADP-DCP adhesive,the researchers investigated the solid content of adhesive,mass ratio of DCP and SADP,synthesis temperature and time.The results revealed that the optimal preparation conditions for the SADP-DCP adhesive were as follows:the solid content was 50%,the mass ratio of DCP to SADP was 1∶3,the synthesis temperature was 70℃,and the synthesis time was 3 h.Using the optimal SADP-DCP-H3 adhesive to manufacture three-layer plywood can improve the bleed-through phenomenon and achieve the average wet shear strength of 0.98 MPa,exceeding 40% of the requirement of GB/T 9846-2015“Plywood for general use”(≥0.7 MPa).The plywood prepared by SADP-DCP-H3 adhesive under the best conditions had no bleed-through phenomenon and met the requirements of the Chinese National Standard GB/T 15104-2006.In the research of curing behavior,the SADP-DCP-H3 adhesive exhibited an insoluble mass proportion of 60% when heated at 170℃ for 7 min,in which heating temperature≥170℃and heating time≥7 min,the SADP-DCP-H3 adhesive can show a better curing performance.Thermal analysis results showed that the endothermic reaction of the SADP-DCP-H3 adhesive occurred at 158℃,being accompanied by a rapid mass loss.It was indicated that the thermal decomposition reaction of the SADP-DCP-H3 adhesive occurred at 158-159℃,and part of the adhesive was converted into water vapor or other volatile small molecules and released into the air,resulting in a mass loss;the other part participated in the polymerization reaction to form a curing substance.The curing mechanism of SADP-DCP-H3 adhesive was studied by the ATR FT-IR analysis,revealing that the molecules in the SADP solution we

关 键 词：环保胶黏剂 胶合板 脱酚棉籽蛋白 蔗糖基胶黏剂。 

分 类 号：TQ321[化学工程—合成树脂塑料工业]