基于嵌铜块印制板的高热流密度芯片传导散热设计  

Heat dissipation analysis for high heat flux chips withthe embedment of copper block based on printed circuit board

作　　者：陈琦[1] 钱吉裕[1] 王锐[1] 李力[1] Chen Qi;Qian Jiyu;Wang Rui;Li Li(The 14th Research Institute of China Electronics Technology Group Co.,Jiangsu Nanjing,210039,China)

机构地区：[1]中国电子科技集团公司第十四研究所,江苏南京210039

出　　处：《机械设计与制造工程》2023年第9期17-20,共4页Machine Design and Manufacturing Engineering

摘　　要：基于印制板层叠结构研究印制板表贴芯片传导散热方式,对常规印制板、金属基底印制板和嵌铜块印制板的热阻进行了分析,并通过三维建模开展了芯片热传导仿真,比较3种印制板结构对芯片传导散热优劣。基于仿真结果设计制作对表贴高热流密度芯片散热最优的嵌铜块印制板,搭建了芯片温度测试平台,通过温度测试结果验证了嵌铜块印制板在芯片传导散热上的有效性,为表贴高热流密度芯片印制板散热提供一种解决方案。Based on the conductive heat dissipation of the laminated printed circuit boards with surface-mounted chips,it analyzes the thermal resistances of the common printed circuit board and embedment of copper block under the chip,builds the conjunction model of the copper plate on the bottom.Through the heat dissipation simulation of the three kinds of printed circuit board,the advantages of the printed circuit board conductive heat dissipation are analyzed.The optimal heat dissipation model for embedded copper block printed board is produced for high heat flux chip heat dissipation.The effectiveness of the embedded copper block printed circuit board in the chip conduction heat dissipation is verified by the test result of chip temperature,which provides a heat dissipation solution for the high heat flow density chip on printed circuit board.

关 键 词：高热流密度芯片 印制板 嵌铜 传导散热 

分 类 号：TK124[动力工程及工程热物理—工程热物理]