铜电解精炼过程中银夹杂物的迁移规律及控制  

Migration regularity and control of silver inclusions during copper electrorefining process

作　　者：冯闻宇 曹华珍 沈宇坤 徐圣航 张惠斌 郑国渠 Wen-yu FENG;Hua-zhen CAO;Yu-kun SHEN;Sheng-hang XU;Hui-bin ZHANG;Guo-qu ZHENG(College of Materials Science and Engineering,Zhejiang University of Technology,Hangzhou 310014,China)

机构地区：[1]浙江工业大学材料科学与工程学院,杭州310014

出　　处：《Transactions of Nonferrous Metals Society of China》2023年第9期2853-2865,共13页中国有色金属学报（英文版）

基　　金：This work was supported by the National Natural Science Foundation of China(No.51374185).

摘　　要：通过热力学计算分析游离Ag^(+)的还原行为,并通过电解实验研究Ag夹杂的控制工艺。结果表明,游离Ag^(+)的放电还原无法避免。As、Sb和Bi所形成的漂浮阳极泥的夹带作用是造成AgCl和Ag胶粒在阴极铜中形成夹杂的关键因素。采用Sb_(2)O_(3)净化铜电解液,减少漂浮阳极泥,从而有效抑制了AgCl和Ag胶粒在阴极铜中的夹杂。在优化条件下,阴极铜中银含量降至7.5 mg/kg以下。The reduction behavior of free Ag^(+)was analyzed by thermodynamic calculation,and the control technique of Ag inclusions was studied by electrolysis experiments.The results show that the discharge reduction of free Ag^(+)is inevitable.The entrainment of floating anode slime formed by As,Sb and Bi is the key factor for the inclusions of AgCl and Ag colloidal particles in cathode copper.Sb_(2)O_(3)is adopted to purify the copper electrolyte and reduce the floating anode slime,thus effectively inhibiting the inclusions of AgCl and Ag colloidal particles.Under the optimized conditions,the Ag content of cathode copper is reduced to less than 7.5 mg/kg.

关 键 词：阴极铜 银夹杂 AGCL Ag胶粒 工艺优化 

分 类 号：TF811[冶金工程—有色金属冶金]