柔性电子封装技术与应用  

Flexible Electronic Packaging Technology and Application

作　　者：赵鹤然 严义君 黄维 李宏军 曹中复[1,2] 陈明祥 刘笛[1,2] 蔡玉辉 ZHAO He-ran;YAN Yi-jun;HUANG Wei;LI Hong-jun;CAO ZHONG-fu;CHEN Ming-xiang;LIU Di;CAI Yu-hui(Liaoning Key Laboratory of Flexible Electronic Micronic Micro-nano Integrated System,Shenyang 110000,China;The 47^(th)Institute of China Electronics Technology Group Corporation,Shenyang 110000,China;Institute of Flexible Electronics,Northwestern Polytechnical University,Xi'an 710072,China;The 13^(th)Institute of China Electronics Technology Group Corporation,Shijiazhuang 050051,China;School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]辽宁省柔性电子微纳集成系统重点实验室,辽宁沈阳110000 [2]中国电子科技集团公司第四十七研究所,辽宁沈阳110000 [3]西北工业大学柔性电子研究院,陕西西安710072 [4]中国电子科技集团公司第十三研究所,河北石家庄050051 [5]华中科技大学机械科学与工程学院,湖北武汉430074

出　　处：《中国电子科学研究院学报》2023年第7期587-596,共10页Journal of China Academy of Electronics and Information Technology

摘　　要：电子封装为芯片提供机械支持、环境保护、电信号引出端和散热通道等重要功能,为了获得较高可靠性,传统封装采用硬质材料体系,难以满足新兴的生物医疗、可穿戴电子、可折叠显示、曲面电子器件等技术领域需求,柔性电子封装颠覆了传统电子系统刚性形态特征,被认为是最有可能实现颠覆性技术创新的领域之一,文中对柔性封装技术及产品的应用领域进行了介绍,并从芯片、基板和封装体三个层面阐述了柔性封装技术的实现方法及面临的挑战,最后,介绍柔性混合电子技术的发展并展望了未来柔性电子技术趋势。Electronic packaging provides important functions such as mechanical support,environmental protection,electrical signal terminals,and heat dissipation channels for chips.The traditional electronic packaging adopts a rigid material system for high reliability.However,it is difficult to meet the demands of emerging biomedical,wearable electronics,foldable display,curved electronic devices and other technical fields.Flexible electronic packaging subverts the rigid morphological characteristics,and is considered one of the areas with the greatest potential for disruptive technological innovation.The application fields of flexible packaging technology and products are introduced.The realization method and challenges of flexible packaging technology are expounded from the three levels of chip,substrate and packaging.Finally,the development of flexible hybrid electronic technology is introduced and the future technology trend of flexible electronic is forecasted.

关 键 词：柔性电子 柔性芯片 柔性封装 柔性基板 

分 类 号：TN41[电子电信—微电子学与固体电子学]