大功率半导体模块封装进展与展望  

Progress and prospect of packaging of high-power semiconductor modules

作　　者：王彦刚 罗海辉 肖强 WANG Yangang;LUO Haihui;XIAO Qiang(Zhuzhou CRRC Times Semiconductor Co.,Ltd.,Zhuzhou,Hunan 412001,China;State Key Laboratory of Power Semiconductor and Integration Technology,Zhuzhou,Hunan 412001,China)

机构地区：[1]株洲中车时代半导体有限公司,湖南株洲412001 [2]功率半导体与集成技术全国重点实验室,湖南株洲412001

出　　处：《机车电传动》2023年第5期78-91,共14页Electric Drive for Locomotives

基　　金：湖南省科技重大项目(2021GK1180)。

摘　　要：大功率半导体模块的发展进化是电力电子系统升级和产业发展的最关键因素。文章根据功率模块的主要应用领域分类,综述了其产品和封装技术的最新进展,分析了新型模块产品的结构和技术特点;然后提出了当前模块封装面临的技术、成本以及新型应用系统要求等方面的挑战,讨论了向高频、高温、高可靠性、模块化等方向发展的挑战;最后对大功率半导体模块的互连及连接技术、集成化和灌封材料、紧凑封装结构的中长期趋势进行了探讨和展望。The evolution of high-power semiconductor module is the most critical factor for upgrading of the power electronics sys‐tem and development of the industry.In this paper,the updated progresses of power module products and packaging technology are re‐viewed according to the application fields,and the structure and technology features of new module products are analyzed.Then,chal‐lenges for the current power module packaging in terms of technology,cost and new application system requirements are proposed.Challenges towards high frequency,high temperature,high reliability and modular development are discussed.Finally,the medium to long term development trend and prospect of interconnection and joining technology,integration and encapsulation material,compact packaging structure of high-power module are presented.

关 键 词：大功率半导体模块 绝缘栅双极晶体管 宽禁带器件 新型封装 先进技术 

分 类 号：TN305.94[电子电信—物理电子学]