化学镀镍/金中铜镍分离的影响因子  

Discussion on the factors influencing the separation of copper and nickel in electroless nickel immersion gold

作　　者：刘梦茹 崔冬冬 唐海波 张勇 LIU Mengru;CUI Dongdong;TANG Haibo;ZHANG Yong(Shengyi Electronics Co.,Ltd.,Dongguan 523127,Guangdong,China)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2023年第10期40-45,共6页Printed Circuit Information

基　　金：东莞市重点领域研发项目(20201200300022)。

摘　　要：讨论了铜镍分离的影响因子,通过交叉对比不同的微蚀、化金药水体系及硫酸来料的影响,对生产过程中所带来的污染源进行试验,最终确定生产过程中带入的污染源导致不同程度的分离问题。通过有效措施进行管控,杜绝了化金线的铜镍分离,并对化金线的铜镍分离问题提供了有效的改善方向。The factors influencing copper and nickel stripping are discussed,through the cross contrast of different micro corrosion,chemical gold liquid system,the effect of sulfuric acid material,and the pollution sources in the process of production.After testing,it is eventually determined that the pollution sources introduced in the process of pollution lead to different degrees of stripping problems.Through effective control measures,the copper and nickel stripping problem of the gold wire is eliminated.Finally,an effective improvement direction for the copper and nickel stripping problem of the gold wire is provided.

关 键 词：化学镀镍/金 孔环 铜镍分离 硫酸纯度 钛 

分 类 号：TQ13[化学工程—无机化工]