Skin mimicking-sweating evaporation polyimide cooling film for electronic devices  

作　　者：JIANG Miao XIAO Chao HE XuSheng DU HuiChao WANG YanYan DING Xin ZHANG Xian LI XiaoFei ZHENG Kang LIU XiangLan CHEN Lin TIAN XingYou 

机构地区：[1]Key Lab of Photovoltaic and Energy Conservation Materials,Institute of Solid State Physics,Hefei Institutes of Physical Science,Chinese Academy of Sciences,Hefei 230031,China [2]Science Island Branch,University of Science and Technology of China,Hefei 230026,China [3]Lu’an Branch,Anhui Institute of Innovation for Industrial Technology,Lu’an 237000,China [4]School of Materials Science and Engineering,Anhui University,Hefei 230039,China

出　　处：《Science China(Technological Sciences)》2023年第10期2797-2807,共11页中国科学（技术科学英文版）

基　　金：the National Natural Science Foundation of China(Grant No.U21A2094);CASHIPS Director's Fund(Grant Nos.YZJJZX202015,YZJJ202304-CX,and YZJJ2023QN36);the Anhui Province Postdoctoral Researcher Research Project(Grant No.E24F0D27)。

摘　　要：In hot environments,the human body shows an efficient capability to maintain a stable temperature by benefiting from sweating behavior.Inspired by this skin perspiration strategy,in this study,we demonstrated an innovative polyimide foam(PIF)-based mimetic skin with excellent cooling capability by integrating a silver coating and reusable hydrogel for the first time.Because of the hybrid thermal dissipating system,the successive silver coating quickly transferred heat to the inside of the polyacrylamide hydrogel.Meanwhile,the hydrogel absorbed a large amount of heat due to its large enthalpy and effectively dissipated heat to the environment through the evaporation of moisture,similar to the sweating of skin.Thus,the temperature of the skin-like film was reduced by 25.4℃compared with pure PIF under a high-power laser heating source.Identical and remarkable cooling effects were also obtained in mobile phone and battery applications,far better than commercially available thermally conductive polyimide(PI).This outstanding performance paves a new way for the thermal management application of PI in wearable electronics,microprocessors,and flexible electronics.

关 键 词：skin-mimicking POLYIMIDE hydrogel thermal management sweat cooling 

分 类 号：TB383.2[一般工业技术—材料科学与工程]