芯片引脚振动断裂故障分析及改进研究  

Fault Analysis and Improvement Research of Chip Pin Vibration Fracture

作　　者：姚佳冬 林克敏 肖伟[1] 丁瑞翔 徐超亮 YAO Jia-Dong;LIN Ke-min;XIAO Wei;DING Rui-xiang;XU Chao-Liang(he 52nd Research Institute of China Electronics Technology Group Corporation,Hangzhou 31l121)

机构地区：[1]中国电子科技集团公司第五十二研究所,杭州311121

出　　处：《环境技术》2023年第9期88-92,共5页Environmental Technology

摘　　要：某型加固电子设备随机振动试验后因芯片引脚断裂引发黑屏故障,本文从零部件加工、装配过程、设计等多角度进行全面分析,结合ANSYS仿真软件进行力学仿真,确定芯片散热结构抗振设计不合理导致引脚在恶劣环境下疲劳断裂。开展改进研究,提出有效整改措施,通过受力对比及试验摸底验证改进措施切实有效。A certain type of reinforced electronic device experienced unable to display fault due to chip pin Fracture after random vibration testing,this article conducts a comprehensive analysis from multiple perspectives such as component processing,assembly process design etc,combined with ANsYs software for mechanical simulation,it is determined that the unreasonable anti-vibration design of the chip's heat dissipation structure caused fatigue fracture of the pins in harsh environments.Conduce improvement research,propose effective rectification measures,verify the effectiveness of improvement measures through force comparison and experimental investigation.

关 键 词：随机振动 断裂 力学仿真 抗振设计 改进研究 

分 类 号：TJ85[兵器科学与技术—武器系统与运用工程]