Sn-Ag-Cu钎料的制备与显微组织性能研究  

Preparation and Microstructural Properties of Sn-Ag-Cu Solder

作　　者：柳砚[1] LIU Yan(School of Mechanical Engineering,Anhui Mechanical and Electrical Technical College,Wuhu 241000,China)

机构地区：[1]安徽机电职业技术学院机械工程学院,安徽芜湖241000

出　　处：《长春师范大学学报》2023年第10期77-81,121,共6页Journal of Changchun Normal University

基　　金：安徽省高校科研重点项目“硬质合金焊接用高性能Ag基钎料箔片研发”(2022AH052351);安徽省高校自然科学研究重点项目“负泊松比结构悬置的力学性能与优化方法研究”(KJ2021A1520)。

摘　　要：Sn-Ag-Cu系低银钎料凭借其优良的工艺和力学性能被普遍认为是最有前途的含铅钎料替代品。为了研究低银钎料的制备及其显微组织特性,制备银的质量分数分别为0、0.3%、0.5%、1.0%的四组低银钎料。比较分析熔化温度与银的质量分数对低银钎料的熔化特性、显微组织、抗拉强度及润湿特性的影响。结果表明,添加少量的银可以降低锡铜钎料的熔化温度,使锡铜钎料的晶粒变得细小,晶粒排列得更加紧密。当钎料中银的质量分数为1.0%时,钎料的抗拉强度达到47.4 MPa,在紫铜基体上的铺展面积为39.9 mm2,润湿角为5.01°。Sn-Ag-Cu based low silver solder is widely regarded as the most promising substitute for lead-containing solder due to its excellent craftsmanship and mechanical properties.In order to study the preparation and microstructure characteristics of low silver brazing alloys,four sets of low silver brazing alloys with silver content of 0,0.3%,0.5%,and 1.0%were prepared.By comparing and analyzing the effects of melting temperature and silver content on the melting characteristics,microstructure,tensile strength,and wetting characteristics of low silver brazing materials.The results show that adding a small amount of silver can reduce the melting temperature of tin copper brazing material,making the grain size of tin copper brazing material smaller and the grain arrangement more compact.When the Silver content in the solder is 1.0%,the tensile strength of the solder reaches 47.4 MPa,the spreading area on the copper substrate is 39.9 mm 2,and the wetting angle is 5.01°.

关 键 词：Sn-Ag-Cu低银钎料 显微组织 力学性能 

分 类 号：TG425.1[金属学及工艺—焊接]