防静电包装外壁微结构设计  

Microstructure Design of Anti-static Packaging Outer Wall

作　　者：周俊杰 陆绍伟 姜凯译[1] ZHOU Junjie;LU Shaowei;JIANG Kaiyi

机构地区：[1]东北林业大学

出　　处：《丝网印刷》2023年第20期45-47,共3页Screen Printing

基　　金：东北林业大学大学生创新创业训练计划“定制化3D打印精密电子元器件防静电包装”的研究成果(编号202310225429)。

摘　　要：分析了静电来源及防静电包装在电子产品中的应用需求,探讨了微结构对防静电性能的影响,研究了现有标准下可行的包装外壁微结构防静电检测方法。通过采取不同的微结构来形成不同的空间孔隙,设计出4种防静电包装外壁微结构,为防静电包装的发展提供了参考。This paper analyzes the sources of electrostatic electricity and the application requirements of anti-static packaging in electronic products,discusses the influence of microstructure on anti-static performance,and studies the feasible anti-static detection methods of microstructure on the outer wall of packaging under existing standards.By adopting different microstructures to form different spatial pores,four kinds of microstructures on the outer wall of anti-static packaging were designed,which provided a reference for the development of anti-static packaging.

关 键 词：防静电包装 包装外壁微结构 3D打印 

分 类 号：TB482.2[一般工业技术—包装工程]