高气密性的深紫外LED半无机封装技术  

Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness

作　　者：万垂铭 曾照明 肖国伟 蓝义安 谢子敬 王洪[1,3] WAN Chuiming;ZENG Zhaoming;XIAO Guowei;LAN Yian;XIE Zijing;WANG Hong(School of Electronics and Information Engineering,South China University of Technology,Guangzhou 510640,China;APt Electronics Co.Ltd.,Guangzhou 511458,China;Zhongshan Institute of Modern Industrial Technology,South China University of Technology,Zhongshan 528437,China)

机构地区：[1]华南理工大学电子与信息学院,广东广州510640 [2]广东晶科电子股份有限公司,广东广州511458 [3]中山市华南理工大学现代产业技术研究院,广东中山528437

出　　处：《发光学报》2023年第10期1842-1848,共7页Chinese Journal of Luminescence

基　　金：广州市科技计划项目(202103030002);广州南沙区重点领域科技项目(2021ZD001);广东省科技计划项目(2020B010171001)。

摘　　要：深紫外LED可通过物理方式破坏病毒和细菌的结构,从而获得高效消毒的效果。相比于工艺成熟的蓝光LED,如何提高深紫外LED的封装可靠性和出光率仍是关键问题。本文采用基底预热方式微固化封装胶,结合阵列点胶方式将石英玻璃固定在镀铜围坝,制备了半无机封装的深紫外LED。该器件的输出波长为275 nm,半峰宽约为11 nm。对比传统类透明材料封装的器件,石英封装的深紫外LED有更高的出光率。在真空红墨水和氦气漏率实验中,采用本文提出的半无机封装技术的深紫外LED器件表现出高密封性。此外,在加速老化测试中,该封装器件的光衰速率在20%以内。实验结果表明,对比有机封装的深紫外LED器件,在基底预热条件下,采用阵列点胶固定石英玻璃是现阶段提高深紫外LED可靠性的一种封装方法。Deep ultraviolet light-emitting diodes(DUV-LEDs)can physically destroy the structure of viruses and bacteria,thus achieving efficient disinfection.Compared with the mature blue LED process,how to improve the packaging reliability and light output efficiency of DUV-LEDs is still a key problem.In this paper,a semi-inorganic packaging DUV-LED was prepared by using substrate preheating method of micro-cured encapsulation adhesive and combining with array dispensation method to bond quartz glass in plated dam copper.The output wavelength of the device is 275 nm and its half-peak width is approximately 11 nm.Quartz-packaged DUV-LEDs have higher light output than traditional devices packaged with transparent materials.DUV-LED devices using the packaging technique presented herein exhibit high air hermeticity in vacuum red ink and helium environments.Moreover,in the accelerated aging test,the light decay rate of this packaged device is less than 20%.Experimental results show that using array dispensing to bond quartz glass under substrate preheating is a packaging method to improve the reliability of DUV-LEDs compared with organic packaging.

关 键 词：深紫外LED 可靠性 出光率 基底预热 阵列点胶 

分 类 号：TN383.1[电子电信—物理电子学]