球磨工艺对SiC粉体研磨质量影响的研究  

Study on the Influence of Ball Milling Process on the Grinding Quality of SiC Powder

作　　者：张馥显 艾秀兰[1] 童小英[2] 杨军[1] ZHANG Fu-xian;AI Xiu-lan;TONG Xiao-ying;YANG Jun(School of Materials Science and Engineering,Dalian Jiaotong University,Dalian Liaoning 116028,China;School of Mechanical Engineering,Dalian Jiaotong University,Dalian Liaoning 116028,China)

机构地区：[1]大连交通大学材料科学与工程学院,辽宁大连116028 [2]大连交通大学机械工程学院,辽宁大连116028

出　　处：《铸造设备与工艺》2023年第5期18-21,共4页Foundry Equipment & Technology

基　　金：辽宁省联合开放基金(2021-KF-15-02)。

摘　　要：为探究球磨过程中工艺参数对SiC粉体粒度及其微观形貌的影响,分别就球磨转速、球料比和磨球材质设计方案并完成球磨试验,采用激光粒度仪和场发射扫描电镜对研磨质量进行检测和观察分析。结果表明:在本次试验条件下,提高球磨转速、提升球料比以及采用高质量的不锈钢球,均可减小粉体粒径,增大粉体颗粒比表面积,使粉体表面形貌更加粗糙,提升球磨效果。In order to explore the influence of process parameters on the particle size and micro-morphology of SiC powder during ball milling,the ball milling test was completed and the ball milling speed,ball-to-material ratio and ball material were designed respectively.Grinding quality was detected and observed by a laser particle size analyzer and field emission scanning electron microscope.The results show that under the conditions of this test,increasing the speed of ball milling,increasing the ratio of ball material and using high quality stainless steel balls can reduce the particle size of powder,improve the specific surface area of powder particles,make the surface topography of powder more rough,improve the effect of ball milling.

关 键 词：SIC粉体 球磨工艺 球磨参数 粒径 比表面积 

分 类 号：TB321[一般工业技术—材料科学与工程]