基于双马来酰亚胺树脂的高耐热电子封装模塑料制备  

Preparation of high heat resistant electronic packaging molding compounds based on bismaleimide resin

作　　者：包颖 黄家腾 朱飞宇 费小马 魏玮 BAO Ying;HUANG Jia-teng;ZHU Fei-yu;FEI Xiao-ma;WEI Wei(School of Chemistry and Materials Engineering,Jiangnan University,Wuxi 214122,China;Wuxi Chuangda New Materials Co.,Ltd.,Wuxi 214028,China)

机构地区：[1]江南大学化学与材料工程学院,江苏无锡214122 [2]无锡创达新材料股份有限公司,江苏无锡214028

出　　处：《热固性树脂》2023年第4期7-13,20,共8页Thermosetting Resin

基　　金：2018年江苏省产学研合作项目(BY2018041)。

摘　　要：采用双马来酰亚胺树脂(BMI70)、2,2′-二烯丙基双酚A(DBA)、多官环氧树脂(EPPN501H)和芳烷基型酚醛树脂(MEH78004S)制备了BDEP四元树脂共混物,研究了不同BMI含量对共混物固化行为和热稳定性的影响。以BDEP四元树脂为基体制备了电子封装模塑料,测试了所得模塑料的热性能、力学性能、耐老化性及介电性能,并与商用环氧模塑料(EMC)进行对比。结果表明,选用质量分数1%的2-乙基-4-甲基咪唑作固化促进剂时,BDEP四元树脂的固化放热峰温约为150℃,可在较低温度下成型。通过优化配方,BDEP模塑料固化物的玻璃化转变温度可达242℃,与商用EMC相比提高了约60℃,最大热分解温度可达455℃,同时具有良好的力学强度和介电性能,在高功率电子元器件封装领域具有良好的应用前景。The BDEP quaternary resin blends were prepared by bismaleimide(BMI 70),2,2′-diallyl bisphenol A(DBA),multi-func-tional epoxy resin(EPPN501H)and aromatic alkyl phenolic resin(MEH78004S).The effects of different BMI contents on the curing behavior of BDEP quaternary resin blends and the thermal stability of the cured products were investigated.The BDEP quaternary resin system was further applied as the matrix resin to prepare electronic packaging molding compounds.The thermal properties,mechanical properties,aging resistance,and dielectric properties of the obtained molding compounds were characterized and compared with those of a commercial electronic packaging epoxy molding compound(EMC).The results showed that when 1 wt%of 2-ethyl-4-methylimidazole was used as curing accelerator,the curing exothermic peak temperature of BDEP quaternary resin system was about 150℃and could be molded at lower temperature.By optimizing the formulation,the glass transition temperature of the cured BDEP molding compound could reach 242℃,which was approximately 60℃higher than that of the commercial EMC.The maximum thermal decomposition temperature of the molding compounds could reach 455℃.At the same time,it had good mechanical strength and di-electric properties,and had a good application prospect in the field of high-power electronic component packaging.

关 键 词：双马来酰亚胺 环氧树脂 模塑料 耐热 高功率电子封装 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]