多尺度球形氧化铝协同提升侧链液晶聚硅氧烷的导热性能  

Synergistic Enhancement of Thermal Conductivity of Side-chain Liquid Crystalline Polysiloxane by Hybrid Spherical Alumina Composites

作　　者：郑小乐 吴昆[1] 杨慧 史珺[1,2] 杨立 ZHENG Xiaole;WU Kun;YANG Hui;SHI Jun;YANG Li(Guangzhou Institute of Chemistry,Chinese Academic of Science,CAS Engineering Laboratory for Special Fine Chemicals,Guangzhou 510650,China;CASH GCC Shaoguan Research Institute of Advanced Materials,CASH GCC(Nanxiong)Research Institute of Advanced Materials Co.,Ltd.,Nanxiong 512400,China;University of Chinese Academic of Science,Beijing 100049,China)

机构地区：[1]中国科学院广州化学研究所,中国科学院新型特种精细化学品工程实验室,广东广州510650 [2]国科广化韶关新材料研究院,国科广化(南雄)新材料研究院有限公司,广东南雄512400 [3]中国科学院大学,北京100049

出　　处：《广州化学》2023年第5期6-10,I0001,共6页Guangzhou Chemistry

基　　金：韶关市科技规划项目(210906134536798)。

摘　　要：设计了一种多尺度Al_(2)O_(3)填充的方式,通过不同尺度粒子构建致密填料网络,以提高侧链液晶聚硅氧烷(SCLCP)复合材料的导热性能。研究了多尺度Al_(2)O_(3)@SCLCP复合材料的微观结构和热性能,结果表明,与单一尺寸Al_(2)O_(3)填充的聚硅氧烷复合材料相比,在相同90%填料负载下,多尺度填充Al_(2)O_(3)@SCLCP复合材料表现出更高的热导率,这归因于适当的多尺度填料形成的有效导热通路。尤其在90%(5μm Al_(2)O_(3)∶40μm Al_(2)O_(3)=3∶2,质量比)的填料负载下,Al_(2)O_(3)@SCLCP复合材料获得了1.931 W/(m·K)的面外热导率,导热性能相比纯聚硅氧烷提升约618%。为制备具有广泛潜在应用前景的高导热复合材料提供了一种简单的策略。The hybrid Al_(2)O_(3)filling strategy was designed to construct dense packing network using particles of different size to improve the thermal conductivity of side-chain liquid crystalline polysiloxane(SCLCP)composites.The micro-structure and thermal management properties of hybrid Al_(2)O_(3)@SCLCP composites were studied.A single size Al_(2)O_(3)filler loaded composites was also prepared.Compared with Al_(2)O_(3)@SCLCP composites with a single size Al_(2)O_(3)filled,it was found that under the same 90%loading,the hybrid Al_(2)O_(3)@SCLCP composites exhibit a higher thermal conductivity,which is due to the effective thermal conductivity path formed by the appropriate hybrid packing.Specifically,the Al_(2)O_(3)@SCLCP composites yield a highκof 1.931 W/(m·K)at 90%(5μm Al_(2)O_(3)∶40μm Al_(2)O_(3)=3∶2)content,improving the thermal conductivity dramatically of pure SCLCP by 618%.Therefore,this study provides a facile strategy for manufacturing high thermal conductivity composites with wide potential application prospects as electronic packaging materials.

关 键 词：导热复合材料 界面热阻 导热系数 球形氧化铝粒子 热界面材料 

分 类 号：TB332[一般工业技术—材料科学与工程]