无氰电镀银及银合金的研究进展  

Research progress of cyanide-free silver and silver alloy electroplating

作　　者：郦博文 郑传波[1] 章哲旭 居殿春[1] 琚翔 吕天一 龚凯飞 潘成宇 LI Bowen;ZHENG Chuanbo;ZHANG Zhexu;JU Dianchun;JU Xiang;LYU Tianyi;GONG Kaifei;PAN Chengyu(Jiangsu University of Science and Technology,Zhangjiagang 215699,China)

机构地区：[1]江苏科技大学,江苏张家港215699

出　　处：《电镀与涂饰》2023年第19期27-33,共7页Electroplating & Finishing

摘　　要：介绍了硫代硫酸盐、碘化物、亚硫酸盐、5,5-二甲基乙内酰脲、丁二酰亚胺、亚氨基二磺酸铵、磺基水杨酸、烟酸等配位体系无氰电镀银及银合金的研究进展,指出了这方面研究目前存在的主要问题,并展望了其研究前景。The progress in research of cyanide-free electroplating of silver and silver alloys with different compounds as complexing agent such as thiosulfate,iodide,sulfite,5,5-dimethylhydantoin,succinimide,diammonium imidodisulfate,sulfosalicylic acid,and niacin was reviewed.The main problems existing in cyanide-free electroplating of silver and silver alloys were pointed out,and the research directions in this field were proposed.

关 键 词：电镀 银及银合金 无氰体系 配位剂 综述 

分 类 号：TQ153.16[化学工程—电化学工业] TQ153.2