还原氧化石墨烯/铜复合热界面材料的实验研究  

Experimental research on reduced Graphene-Oxide/Copper composite thermal interface materials

作　　者：曾发兵 张月星 张平[1] ZENG Fabing;ZHANG Yuexing;ZHANG Ping(School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China)

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《桂林电子科技大学学报》2023年第4期340-344,共5页Journal of Guilin University of Electronic Technology

基　　金：国家自然科学基金(52076048)。

摘　　要：为了提高热界面材料的导热性能,采用电泳沉积法制备还原氧化石墨烯/铜复合材料,对比分析还原氧化石墨烯/铜、多层石墨烯和纳米银对环氧树脂热导率的增强效果。采用扫描电镜对还原氧化石墨烯/铜复合材料的微观形貌进行表征;使用热常数分析仪、数字式粘度计和接触热阻测试仪分别对环氧树脂基复合热界面材料的热导率、粘度和界面热阻进行调控测试。结果表明,实验成功制备了还原氧化石墨烯/铜,且金属铜颗粒均匀分布在石墨烯片层间;还原氧化石墨烯/铜、多层石墨烯、纳米银对环氧树脂的导热系数均有提高;还原氧化石墨烯/铜复合材料质量分数为30%时,环氧树脂基复合热界面材料的导热系数提高了4.5倍;在0.9 MPa压力下,界面接触热阻为37.06 mm^(2)·K·W^(-1),与不添加界面材料时相比降低了35.9%(未添加热界面材料时界面接触热阻为57.84 mm^(2)·K·W^(-1))。高导热材料能提高环氧树脂基热界面材料的热导率,可显著改善接触面的传热性能。In order to improve the thermal conductivity of thermal interface materials,reduced graphene oxide/copper composite materials were prepared by electrophoretic deposition,and the effects of reduced graphene oxide/copper,multilayer graphene and nano-silver on the thermal conductivity of epoxy resin were compared and analyzed.The microscopic morphology of the reduced graphene oxide/copper composite material was characterized by scanning electron microscopy.Thermal constant analyzer,digital viscometer and contact thermal resistance tester were used to control and test the thermal conductivity,viscosity and interface thermal resistance of epoxy resin-based composite thermal interface materials.The results show that the experiment successfully prepared reduced graphene oxide/copper,and the metal copper particles were evenly distributed between graphene sheets;in addition,the thermal conductivity of reduced graphene oxide/copper,multilayer graphene,and nano-silver to epoxy resin both have improved.When the mass fraction of the reduced graphene oxide/copper composite material is 30%,the thermal conductivity of the epoxy resin-based composite thermal interface material is increased by 4.5 times.Under a pressure of 0.9 MPa,the interface contact thermal resistance is 37.06 mm^(2)·K·W^(-1),which is 35.9% lower than when no interface material is added(the interface contact thermal resistance is 57.84 mm^(2)·K·W^(-1) when no thermal interface material is added.).High thermal conductivity materials can increase the thermal conductivity of epoxy resin-based thermal interface materials and significantly improve the heat transfer performance of the contact surface.

关 键 词：热界面材料 热导率 接触热阻 石墨烯/铜 电泳沉积法 

分 类 号：TB333[一般工业技术—材料科学与工程]