形变时效工艺对Cu-Sc合金组织及性能的影响  

Microstructure and Properties of Cu-Sc Alloy Deformation Aging Process

作　　者：高帆 张兴德 高浩 杨甜 曹飞 姜伊辉[1] GAO Fan;ZHANG Xingde;GAO Hao;YANG Tian;CAO Fei;JIANG Yihui(School of Materials Science and Engineering,Xi'an University of Technology,Conductive Materials and Compos-ite Technology Engineering Research Center of the Ministry of Education,Shaanxi Provincial Key Laboratory of Elec-trical Materials and Infiltration Technology,Xi'an 710048,China)

机构地区：[1]西安理工大学材料科学与工程学院,导电材料与复合技术教育部工程研究中心,陕西省电工材料与熔渗技术重点实验室,陕西西安710048

出　　处：《铜业工程》2023年第5期17-24,共8页Copper Engineering

基　　金：国家自然科学基金项目(51974244,52271137)资助。

摘　　要：研究了形变时效工艺对不同Sc含量的Cu-xSc合金(x=0.1,0.2,0.3,0.4;质量分数)微观组织、力学性能和导电性能的影响。结果显示,随着Sc含量增加,Cu-xSc合金基体晶粒尺寸逐渐减小;Cu-Sc合金硬度随着Sc含量的增加而增加,导电率随着Sc含量的增加而下降。不同Sc含量的Cu-xSc合金均在400℃时效60 min后达到峰值时效,从而获得合理的硬度和导电率匹配。为了进一步提升合金的强度和导电率,对Cu-xSc合金进行两步形变时效处理,观察组织发现两步形变时效后基体中产生大量变形孪晶,变形孪晶与纳米析出相相互作用显著提升Cu-xSc合金的力学性能与导电性能。预时效先析出的纳米相会诱导产生大量孪晶束和高密度位错,有利于在终时效过程中促进固溶原子析出,从而提升合金的强度和导电率。两步形变时效后经计算综合评估,Cu-0.4Sc合金具有更优的强度和导电率匹配,其抗拉强度和导电率分别为656 MPa和67.8%IACS,较一步形变时效分别提升了19.7%和18.7%。In this paper,the effects of deformation aging process on the microstructure,mechanical and electrical properties of Cu-xSc(x=0.1,0.2,0.3,0.4;mass fraction)alloys with different Sc contents were studied.The results showed that with the increase of Sc con-tent,the grain size of Cu-xSc alloys matrix decreased gradually.The hardness of Cu-xSc alloy increased with the increase of Sc content,and the conductivity decreased with the increase of Sc content.Cu-xSc alloys with different Sc contents all reached the peak aging after aging at 400℃for 60 min,so as to obtain a reasonable matching of hardness and conductivity.In order to further improve the strength and conductivity of the alloy,Cu-xSc alloys were subjected to two-step deformation aging treatment.It was found that a large number of deformation twins were generated in the matrix after two-step deformation aging,and the interaction between deformation twins and na-no-precipitates significantly improved the mechanical and electrical properties of Cu-xSc alloys.The nano-phase precipitated before pre-aging would induce a large number of twin beams and high-density dislocations,which was beneficial to promote the precipitation of solid solution atoms during the final aging process,thereby improving the strength and conductivity of the alloy.After two-step defor-mation and aging,Cu-0.4Sc alloy had better matching of strength and conductivity.The tensile strength and conductivity of Cu-0.4Sc al-loy were 656 MPa and 67.8%IACS,respectively,which were 20.6%and 18.7%higher than those of one-step deformation and aging.

关 键 词：Cu-Sc合金 两步形变时效 形变孪晶 高强高导 

分 类 号：TF813[冶金工程—有色金属冶金] TF804.2