基于数值模拟与实验的弯液面约束电化学沉积工艺研究  

Meniscus Constrained Electrode Position Process Based on Numerical Simulation and Experiment

作　　者：王雪[1,2] 许金凯 任万飞[1,2] 韦含含 王曼妃 徐振铭 WANG Xue;XU Jin-kai;REN Wan-fei;WEI Han-han;WANG Man-fei;XU Zhen-ming(Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing,Changchun University of Science and Technology,Changchun 130022,China;School of Mechanical and Elec-trical Engineering,Changchun University of Science and Technology,Changchun 130022,China)

机构地区：[1]长春理工大学跨尺度微纳制造教育部重点实验室,长春130022 [2]长春理工大学机电工程学院,长春130022

出　　处：《精密成形工程》2023年第11期107-114,共8页Journal of Netshape Forming Engineering

基　　金：国家重点研发计划(2022YFB4600202);国家自然科学基金(U19A20103);吉林省创新创业人才资助项目(2021Z002);长春市科技发展计划基金(21ZY37)。

摘　　要：目的研究影响弯液面约束电沉积(MCED)的工艺参数(电压、浓度、湿度和喷嘴移动速度),以确保制造出满足要求的高性能金属微结构。方法首先采用COMSOL有限元仿真研究了沉积过程中不同电压、浓度、湿度和喷嘴移动速度对MCED沉积速率的影响,确定了MCED在上述参数影响下的变化规律。其次,进行了工艺试验,验证了仿真结果的正确性。结果仿真结果表明,MCED沉积速率与电压、电解液浓度呈正相关。喷嘴移动速度会影响金属微结构的初始沉积直径和沉积速率,喷嘴移动速度越慢,沉积结构初始直径越大,沉积速率相对越慢,而且还会影响沉积能否顺利进行。实验结果表明,在相同湿度下,在弯液桥边缘位置存在相对湿度梯度,易产生强对流,在边缘位置,加快扩散速度将会造成边缘优先生长。在不同湿度下,易出现空心结构和实心结构。结论通过将仿真与实验相结合,得到了沉积速率、沉积形状与电压、电解液浓度、喷嘴移动速度和湿度之间的关系,通过调控工艺参数(电压、浓度、湿度和喷嘴移动速度)得到最佳适用值,可获得沉积质量较好的金属微结构。The work aims to investigate the process parameters(voltage,concentration,humidity,and nozzle travel speed)affecting the meniscus constrained electrode position(MCED)to ensure the fabrication of high-performance metal microstructures that meet the requirements.Firstly,COMSOL finite element simulation was used to study the effects of different voltages,concentrations,humidity and nozzle travel speed changes on the MCED deposition rate during deposi-tion,and the regular changes of MCED under the effects of the above parameters were determined.Then,process tests under different parameters were carried out to verify the correctness of the simulation results.The simulation results showed that the MCED deposition rate was positively correlated with voltage and electrolyte concentration.The nozzle travel speed affected the initial deposition diameter and deposition rate of metal microstructures.The slower the nozzle travel speed,the larger the initial diameter of the deposited structure,and the relatively slower the deposition rate.It also affected whether the deposition could be carried out smoothly.Experimental results showed that in the same humidity,there was a relative humidity gradient at the edge of the curved liquid bridge,which was likely to produce strong convec-tion at the edge,accelerate the diffusion rate,and cause preferential growth at the edge.Under different humidity,hollow and solid structures were likely to appear.Through a combination of simulation and experiment,it is determined that the deposition rate and deposition shape are affected by voltage,electrolyte concentration,nozzle travel speed and humidity,and that metal microstructures good deposition quality can be obtained by accurately regulating the optimum applicable values of the process parameters(voltage,concentration,humidity and nozzle travel speed).

关 键 词：弯液面约束电沉积 有限元模拟 工艺参数 沉积形貌 沉积速率 金属微结构 

分 类 号：TH162[机械工程—机械制造及自动化]