水基干压成型高导热氮化硅陶瓷的结构和性能  被引量:1

Structure and Properties of High Thermal Conductivity Silicon Nitride Ceramics by Aqueous Dry Pressing

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作  者:田云龙 祁海[1] 张培志[1] 郭方全[1] 韩伟月 TIAN Yunlong;QI Hai;ZHANG Peizhi;GUO Fangquan;HAN Weiyue(Shanghai Key Laboratory of Engineering Materials Application and Evaluation,Shanghai Research Institute of Materials Co.,Ltd.,Shanghai 200437,China)

机构地区:[1]上海材料研究所有限公司,上海市工程材料应用与评价重点实验室,上海200437

出  处:《机械工程材料》2023年第9期46-51,共6页Materials For Mechanical Engineering

摘  要:以α-Si_(3)N_(4)、β-Si_(3)N_(4)、MgO、Y_(2)O_(3)为原材料,利用以水为分散介质的水基干压成型工艺在不同温度(1 750,1 850℃)下烧结制备高导热氮化硅陶瓷,研究了不同烧结温度下陶瓷的结构、力学性能和热导率,并与以无水乙醇作为分散介质的非水基干压成型氮化硅陶瓷进行对比。结果表明:陶瓷的晶粒均呈长柱状,并且零散的粗大晶粒周围分布着较多的细长晶粒,呈双模式组织结构;1 750,1 850℃烧结温度下水基干压成型陶瓷的抗弯强度分别为555.7,747.5 MPa,断裂韧度分别为8.14,8.25 MPa·m^(1/2),均略低于非水基干压成型陶瓷,相对密度分别为99.00%,99.58%,平均晶粒尺寸分别为1.06,1.27μm,热导率分别为65.70,75.54 W·m^(-1)·K^(-1),均略高于非水基干压成型陶瓷。High thermal conductivity silicon nitride ceramics were prepared by aqueous dry pressing process with water as dispersing medium and sintering at different temperatures(1 750,1 850 ℃) using α-Si_3N_4,β-Si_3N_4,MgO,Y_2O_(3) as raw materials.The structure,mechanical properties and thermal conductivity of the ceramics at different sintering temperatures were studied and compared with those of non-aqueous dry pressed silicon nitride ceramics with anhydrous ethanol as the dispersing medium.The results show that the grains of the ceramics were all long columnar,and there were many slender grains distributed around the scattered coarse grains,showing a dual-mode structure.At the sintering temperature of 1 750,1 850 ℃,the bending strengths of aqueous dry pressed ceramics were 555.7,747.5 MPa,and the fracture toughnesses were 8.14,8.25 MPa·m~(1/2),respectively,which were slightly lower than those of non-aqueous dry pressed ceramics;the relative densities were 99.00%,99.58%,the average grain sizes were 1.06,1.27 μm,and thermal conductivities were 65.70,75.54 W·m~(-1)·K~(-1),respectively,which were slightly higher than those of non-aqueous dry pressed ceramics.

关 键 词:氮化硅陶瓷 分散介质 热导率 力学性能 

分 类 号:TQ127.2[化学工程—无机化工]

 

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