铝带超声键合界面损伤机理分析与优化设计  

Damage Mechanism Analysis and Optimal Design of Joint Interface in Aluminum Ribbon Ultrasonic Bonding

作　　者：周杰 ZHOU Jie(Shenzhen STS Microelectronics Co.,Ltd.,Shenzhen 518048,China)

机构地区：[1]深圳赛意法微电子有限公司,广东深圳518048

出　　处：《电子工艺技术》2023年第6期56-59,63,共5页Electronics Process Technology

摘　　要：铝带超声键合过程中需要极大的键合能量和键合力作用在芯片表面,易造成芯片焊点界面损伤,从而引起产品质量与可靠性问题。详细分析了铝带超声键合工艺中造成芯片界面损伤的主要因素与作用机理,并通过键合参数的试验设计(Design of experiment,DOE)来解决芯片焊点界面损伤问题,从而提升最终产品良率。During the ultrasonic bonding process of aluminum ribbon,higher bonding energy and force are required to act on the surface of the chip,which can easily cause damage to solder joints interface,leading to quality and reliability issues.A detailed analysis is conducted on the main factors and mechanisms causing chip interface damage in the ultrasonic bonding process of aluminum ribbon.Design of experiment of bonding parameters is carried out to get the optimized parameters,thereby improving the fi nal product yield.

关 键 词：铝带超声键合 焊点界面 界面损伤 试验设计 

分 类 号：TN405[电子电信—微电子学与固体电子学]