电子接插件卷对卷连续高速镀金封孔剂的综合性能评价  

Method for evaluating the comprehensive performance of sealing agent used for rapid roll-to-roll continuous gold electroplating on electronic connectors

作　　者：杨希明 吴鹏程 杨希军 李晓明 龚俊锋 叶繁 龙磊 邓绍雄 邓南方 YANG Ximing;WU Pengcheng;YANG Xijun;LI Xiaoming;GONG Junfeng;YE Fan;LONG Lei;DENG Shaoxiong;DENG Nanfang(FUDING Precision Components(Shenzhen)Co.,Ltd.,Foxconn Technology Group,Shenzhen 518110,China)

机构地区：[1]富士康科技集团富顶精密组件(深圳)有限公司,广东深圳518110

出　　处：《电镀与涂饰》2023年第21期65-72,共8页Electroplating & Finishing

摘　　要：从镀层品质、封孔效率、封孔剂成本和环保性能4个方面,建立了电子接插件卷对卷高速镀金封孔剂的技术评价项目。阐述了各项性能的测试方法,并对3种封孔剂的综合性能进行了量化评价,为电镀生产企业选用性能优异的镀金封孔剂提供参考。A method for technical evaluation of sealing agent used for rapid roll-to-roll gold electroplating in laboratory were established from the following aspects:properties of gold coating,efficiency of sealing,cost of sealing agent,and environmental friendliness.The test methods were described.The comprehensive performance of three sealing agents were quantitatively evaluated,providing a reference for plating plants to select excellent sealing agent for gold coatings.

关 键 词：电子接插件 卷对卷电镀金 封孔剂 评价方法 

分 类 号：TQ153.18[化学工程—电化学工业]