电子用反应型聚氨酯热熔胶的研制  

Preparation of Reactive Polyurethane Hot-melt Adhesive for Electronics

作　　者：陈精华 张健臻 陈建军 黄恒超 Chen Jinghua;Zhang Jianzhen;Chen Jianjun;Huang Hengchao(Guangzhou Baiyun Technology Co.,Ltd.,Guangzhou 510540,China)

机构地区：[1]广州白云科技股份有限公司,广东广州510540

出　　处：《广东化工》2023年第22期1-3,共3页Guangdong Chemical Industry

摘　　要：利用结晶聚酯多元醇、液体多元醇、增粘树脂、多异氰酸酯、催化剂等为原料,制备了电子用反应型聚氨酯热熔胶(PUR),考察了结晶聚酯多元醇、液体聚酯多元醇、增粘树脂、催化剂对电子用PUR性能的影响。结果表明,当Dynacoll®7380与Dynacoll?7360的重量比为10∶40、液体聚酯多元醇为Stepanpol®PDP70且其用量为25 wt%,增粘树脂为萜烯酚醛树脂且其用量为8 wt%,催化剂为ZF-10+T12复配体系时且其用量为0.1 wt%时,电子用PUR具有最好的综合性能。Reactive polyurethane hot-melt adhesive(PUR)for electronics were prepared with crystalline polyester polyols,liquid polyols,tackifying resin,polyisocyanate,catalyst,etc.The effects of crystalline polyester polyols,liquid polyester polyols,tackifying resin,catalyst on properties of PUR were studied.The results showed PUR had the best overall performance when the weight ratio of Dynacoll®7380 and Dynacoll®7360 was 10:40,the liquid polyols was Stepanpol®PDP70 and the amount was 25 wt%,the tackifying resin was terpene phenolic resin and the amount was 8 wt%,and the catalyst was ZF-10+T12 composite and the amount was 0.1 wt%.

关 键 词：反应型聚氨酯热熔胶 聚酯多元醇 增粘树脂 

分 类 号：TQ436.4[化学工程]