SiO_(2)杂化环氧树脂耐热性能研究  

Study on heat resistance of SiO_(2)hybrid epoxy resin

作　　者：荣立平 王刚[1] 李志国[2] 张大勇[1] 朱金华[1] 李欣[1] RONG Li-ping;WANG Gang;LI Zhi-guo;ZHANG Da-yong;ZHU Jin-hua;LI Xin(Institute of Petroleum Chemistry,Heilongjiang Academy of Sciences,Harbin 150040,China;College of Material Science and Engineering,Northeast Forestry University,Harbin 150040,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]东北林业大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《热固性树脂》2023年第3期29-33,共5页Thermosetting Resin

摘　　要：采用溶胶-凝胶技术合成了一种SiO_(2)杂化环氧树脂,以2-乙基-4-甲基咪唑固化,测试了固化体系的力学及耐热性能。结果表明,80,120,150℃下该体系的拉伸剪切强度较未杂化环氧体系分别提高了40%,32%,34%。DSC测试固化物的玻璃化温度提高4.6℃,起始分解温度提高10.6℃,分解峰温提高4.2℃。采用Kissinger法研究该硅杂化环氧体系的热分解动力学表明其热分解反应活化能提高了5.6%,杂化后环氧树脂耐热性能得到提高。固化物SEM照片显示,SiO_(2)在环氧树脂中分散均匀。The SiO_(2)hybrid epoxy resin was synthesized by sol-gel technology,which was cured with 2-ethyl-4-methylimidazole,and the mechanical properties and heat resistance of the cured system were tested.The results showed that the tensile shear strength of the system at 80,120 and 150℃was increased by 40%,32%and 34%,respectively,compared with the unhybridized epoxy system.The glass transition temperature,initial decomposition temperature and decomposition peak temperature of the cured product by DSC test was increased by 4.6,10.6 and 4.2℃,repectively.The thermal decomposition kinetics of the silicon hybrid epoxy system was studied by Kissinger method,which showed that the activation energy of the thermal decomposition reaction was increased by 5.6%,and the heat resistance of the epoxy resin was improved after hybridization.The SEM images of the cured product showed that SiO_(2)was uniformly dispersed in epoxy resin.

关 键 词：SiO_(2) 杂化环氧树脂 耐热性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]