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作 者:程铂涵 杨晓京[1] 郭彦军 姚同 康杰 Cheng Bohan;Yang Xiaojing;Guo Yanjun;Yao Tong;Kang Jie(Faculty of Mechanical and Electrical Engineering,Kunming University of Science and Technology,Kunming 650500,Yunnan,China;Yunnan KIRO Photonics Co.,Ltd.,Kunming 650217,Yunnan,China)
机构地区:[1]昆明理工大学机电工程学院,云南昆明650500 [2]云南北方光学科技有限公司,云南昆明650217
出 处:《激光与光电子学进展》2023年第19期156-162,共7页Laser & Optoelectronics Progress
摘 要:为了提高单点金刚切削单晶锗的表面质量,进行了三因素四水平的正交试验,并采用方差分析和极差分析,研究了在单晶锗表面质量分布不均匀条件下表面粗糙度受切削参数的影响。试验结果显示:主轴转速对表面粗糙度值影响明显,而且贡献率最高,主轴转速越大,则表面粗糙度值也越小。获得的最优切削参数组合为主轴转速为3800 r/min、进给速率为2 mm/min、最大切削深度为5μm。在此切削条件下得到了表面粗糙度为2.4 nm的高精度单晶锗,在扫描电镜下观察其表面质量较好,且表面也比较平滑,切削过程中的切屑呈带状,材料在塑性范围内去除。In order to improve the surface quality of single-point diamond cutting single-crystal germanium,the orthogonal experiment of three factors and four levels is carried out,and the effect of cutting parameters on the surface roughness under the condition of uneven surface quality distribution of single-crystal germanium is studied by variance analysis and range analysis.The test results show that the contribution rate is the highest when the spindle speed has obvious influence on the surface roughness value,indicating that the larger the spindle speed is,the smaller the surface roughness value is.As a result,an optimal combination of the cutting parameters obtained is that a spindle speed of 3800 r/min,feed rate of 2 mm/min,and maximum cutting depth of 5 μm.Under this cutting condition,high-precision single-crystal germanium with a surface roughness of 2.4 nm is obtained.Next,the surface quality is good and the surface is relatively smooth according to the scanning electron microscope.The chips during cutting are banded,and the material is removed in the plastic range.
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