PCB阻焊剂低压喷涂均匀性提升研究  

Research on improving the solder mask uniformity by low⁃pressure spraying on PCB

作　　者：王均臣 许校彬 朱爱军 张子超 WANG Junchen;XU Xiaobin;ZHU Aijun;ZHANG Zichao(Huaian Glorysky Electronic Technology Co.,Ltd.,Huaian 223499,Jiangsu,China)

机构地区：[1]淮安特创科技有限公司,江苏淮安223499

出　　处：《印制电路信息》2023年第11期27-31,共5页Printed Circuit Information

摘　　要：主要针对印制电路板(PCB)阻焊层常用的低压喷涂机进行设计试验测试,确定适用于线面阻焊油墨厚度在10~30μm范围内的可加工工艺参数。提升了低压喷涂过程中的均匀性,同时提高了工艺的可控性和一致性。This study aims to conduct design experiments and tests for the low-pressure spraying machine commonly used in the printed circuit board industry to determine the process parameters that are applicable to the thickness of the solder mask in the range of 10-30μm.Through research,we successfully improve the uniformity of low-pressure spraying processes,and improve the controllability and consistency of the process.

关 键 词：阻焊剂 低压喷涂机 油墨厚度 均匀性 

分 类 号：TG3[金属学及工艺—金属压力加工]