PPO基材的PCB内层连接不良改善研究  

Study on ICD improvement of PCB with PPO substrate

作　　者：马奕 彭浪 胡新星 程骄 陈国梁 MA Yi;PENG Lang;HU Xinxing;CHENG Jiao;CHEN Guoliang(Jingwang Electronic Technology(Zhuhai)Co.,Ltd.,Zhuhai 519000,Guangdong,China)

机构地区：[1]景旺电子科技(珠海)有限公司,广东珠海519000

出　　处：《印制电路信息》2023年第11期32-36,共5页Printed Circuit Information

摘　　要：5G通信的应用使得通信科技迎来了新的时代。作为通信产品的载体,印制电路板(PCB)也朝着高频、高速的方向发展,具有低损耗、高稳定性的聚苯醚(PPO)材料被广泛应用于通信类产品PCB。从PPO材料的特性出发,探讨在PCB的加工过程中,通过调整不同的钻孔和等离子参数,改善PPO内层连接不良(ICD)的问题。The arrival of 5G brings communication technology into a new era.Printed circuit board(PCB),as the carrier of communication products,is developing in the direction of high frequency and high speed.Polyphenylene oxide(PPO)material with low loss and high stability has been widely used in this kind of PCB products.Based on the characteristics of PPO material,this paper discusses how to solve inner connection defects(ICDs)of PPO by improving different drilling and plasma parameters in the process of PCB processing.

关 键 词：聚苯醚基材 内层连接 等离子体 钻孔 

分 类 号：TQ31[化学工程—高聚物工业]