微量Ni对Sn-Bi-Ag焊料合金性能的影响  

Microstructure and Properties of Quaternary Sn-Bi-Ag-Ni Solder Alloy

作　　者：陈胜 刘亚 戴健 郭志球 吴长军 陶小马[3] 王建华 苏旭平 Chen Sheng;Liu Ya;Dai Jian;Guo Zhiqiu;Wu Changjun;Tao Xiaoma;Wang Jianhua;Su Xuping(Jiangsu Key Laboratory of Materials Surface Science and Technology,Changzhou University,Changzhou 213164,China;Jinko solar Co.,Ltd.,Haining 314416,China;College of Physical Science and Technology,Guangxi University,Nanning 530004,China)

机构地区：[1]常州大学材料科学与工程学院江苏省材料表面科学与技术重点实验室,江苏常州213164 [2]浙江晶科能源有限公司,浙江海宁314416 [3]广西大学物理科学与工程技术学院,广西南宁530004

出　　处：《稀有金属》2023年第9期1232-1242,共11页Chinese Journal of Rare Metals

基　　金：国家自然科学基金项目(51871030,52171003);江西省技术创新引导类计划项目(20212BDH81033)资助。

摘　　要：在Sn基无铅焊料合金中,Sn-Bi-Ag系焊料合金由于其较低的熔点和良好的力学性能,被认为是传统Sn-40Pb(%,质量分数)焊料合金的替代品。但是Sn-Bi-Ag系焊料合金的润湿性相较于Sn_(60)Pb_(40)焊料仍较差,并且关于Sn-Bi-Ag系焊料合金的研究主要集中在Sn-Bi共晶部分。利用扫描电镜配备能谱仪(SEM+EDS)、X射线衍射仪(XRD)、差示扫描热量仪(DSC)、电子万能试验机、高温接触角测量仪等分析测试方法研究了在Sn-Bi亚共晶部分添加微量Ni元素,对Sn-xBi-1Ag(x=35,37,45,47;%,质量分数)系焊料合金的微观组织、熔化性能、抗拉强度、润湿性能及界面反应的影响。结果表明:在Sn-Bi-1Ag系焊料中加入0.5%Ni(质量分数)后,其组织中形成了Ni_(3)Sn_(4)相,改善了焊料合金的润湿性能,虽然其抗拉强度有所降低,但仍优于传统Sn_(60)Pb_(40)焊料;同时,微量Ni加入后对焊料合金的主峰起始点温度,主、次峰温度并无明显变化,但当Bi含量为45%或47%时,焊料合金的熔程扩大。此外,Sn-Bi-Ag-Ni/Cu界面处(Cu,Ni)_(6)Sn_(5)层的厚度相比于Cu_(6)Sn_(5)层较薄,而且更加连续、致密。对于开发低温光伏焊料提供了实验依据,具有重要意义。Photovoltaic modules have been developing towards thinness and miniaturization.The thinner the battery plate,the lower the welding temperature of the photovoltaic ribbon.Sn-Bi solder has been recognized as an ideal choice for low-temperature lead-free solder due to its low melting point and low cost.But Bi element had poor wettability and tended to coarsen at high temperature,which would deteriorate its plasticity and ductility.Therefore,a small amount of Ag was added to Sn-Bi solder to improve its performance.Research on Sn-Bi-Ag solder had focused on the eutectic part of Sn-58Bi and the low eutectic part of Sn-10Bi,however,the mechanical properties of eutectic solder were poor and the melting point of low eutectic solder was high,which could not meet the needs of industrial production.Scanning electron microscopy(SEM)coupled with energy dispersive spectrometer(EDS)and X-ray diffraction analysis(XRD),differential scanning calorimetry(DSC),electronic universal testing machine and wetting angle meter were used to explore the effect of Ni on the microstructure and properties of Sn-xBi-1Ag(x=35,37,45,47;%,mass fraction)solder alloys.According to the microstructure and based on the differences of shape and brightness on grayscale images,there were four different phases in the alloy when Ni element was added into Sn-Bi-Ag solder alloys.Combined with EDS analysis,the bright phase was Bi phase,the grey matrix was Sn phase,and there was a small amount of dark grey Ag_(3)Sn phase distributed on Sn phase matrix.When Bi content was low,Ni_(3)Sn_(4) phase presented multilateral shape,while when Bi content was high,the Ni_(3)Sn_(4) phase presented long whisker shape.The XRD pattern of Sn-Bi-Ag-Ni solder alloys showed that there was no significant difference in the diffraction peaks of the solder alloys,and only the characteristic peaks of Sn and Bi phases were found,while the characteristic peaks of Ag_(3)Sn and Ni_(3)Sn_(4) were not detected.DSC curves of Sn-45Bi-1Ag-0.5Ni and Sn-47Bi-1Ag-0.5Ni solder alloys had only one mai

关 键 词：Sn-Bi-Ag-Ni 润湿性 抗拉强度 熔化性能 界面反应 

分 类 号：TG425[金属学及工艺—焊接]