400G FR4硅光收发模块的研究  

Design of 400G FR4 silicon photonics optical transceiver module

作　　者：宋泽国 尹小杰[2] 刘智[2] 郝沁汾 SONG Zeguo;YIN Xiaojie;LIU Zhi;HAO Qinfen(Wuxi Institute of Interconnect Technology,Co.,Ltd.,Wuxi 214101,China;Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100038,China;Institute of Computing Technology,Chinese Academy of Sciences,Beijing 100190,China)

机构地区：[1]无锡芯光互连技术研究院,江苏无锡214101 [2]中国科学院半导体研究所,北京100038 [3]中国科学院计算技术研究所,北京100190

出　　处：《微电子学与计算机》2023年第11期72-79,共8页Microelectronics & Computer

基　　金：国家重点研发计划(2022YFB4401501)。

摘　　要：随着5G、人工智能的大规模应用,数据中心使用的光模块也相应朝着高速率和低成本方向发展.根据上述需求,介绍了一种400G FR4硅光收发模块设计方案,研发了相应的核心光子器件,该模块使用硅基电光调制器来实现高速率的光信号调制,搭配波分复用解复用器进一步提高模块的整体传输速率,并通过测试验证了器件的性能满足设计要求.采用板上芯片封装(Chip-On-Board,COB)技术,通过对模块光路部分开发设计,激光器到调制器的耦合效率可以达到−2.1 dB,实现了各光电器件之间的低损耗耦合,为400G光模块的设计和实现提供参考.With the large-scale application of 5G and artificial intelligence,the optical module will develop to high speed and low price in the future.Based on the above requirements,this paper proposes a 400G FR4 silicon photonics optical transceiver module design,develops core photonic devices.The module uses a silicon-based electro-optical modulator to achieve high-rate optical signal modulation,and is paired with wavelength division multiplexing and demultiplexing devices to further increase the overall transmission rate of the module,and verifies that the device performance meets the design requirements.The optical path of 400G FR4 optical module has been designed with the method of Chip On Board(COB)packaging technology,and the coupling efficiency from the laser to the modulator can reach−2.1 dB,achieving lowloss coupling between various optoelectronic devices,which provides a guidance for the design of 400G optical module.

关 键 词：光通信 400G光模块 硅基调制器 波分复用 板上芯片封装 

分 类 号：TN256[电子电信—物理电子学]