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作 者:李文 张筱君 江伟辉 徐彦乔 吴倩 LI Wen;ZHANG Xiaojun;JIANG Weihui;XU Yanqiao;WU Qian(Jingdezhen Ceramic University,Jingdezhen 333403,China;National Engineering Research Center for Domestic&Building Ceramics,Jingdezhen 333001,China)
机构地区:[1]景德镇陶瓷大学材料科学与工程学院,景德镇333403 [2]国家日用及建筑陶瓷工程技术研究中心,景德镇333001
出 处:《中国陶瓷》2023年第11期70-85,共16页China Ceramics
基 金:国家自然科学基金(52262003,52072162,51962014);江西省自然科学基金(20202BABL214013,20202ACBL214006,20202ACBL214008)江西省教育厅基金(GJJ211343,GJJ211315,GJJ201345,GJJ190736);景德镇市科技计划项目(20212GYZD009-06,2020GYZD013-09,2020GYZD012,2020GYZD013-13);景德镇陶瓷产业重大攻关(2021ZDGG001)。
摘 要:硅酸锆包裹炭黑(C@ZrSiO_(4))色料是一种无毒环保型黑色陶瓷色料。因其优异的高温稳定性、化学稳定性和抗釉熔体腐蚀性,在无机陶瓷色料领域受到了广泛关注,有望替代传统含重金属Ni、Cr、Co等尖晶石型黑色色料。但是炭黑表面官能团的含量较低,导致炭黑分散性差、易团聚,以及包裹率低不易与硅酸锆结合,离实际工业化应用还有一定距离。从硅酸锆包裹色料的包裹模型入手,详细阐述了包裹过程的影响因素。在此基础上详细介绍了目前提高C@ZrSiO_(4)色料包裹效率的有效途径,包括了炭黑的表面改性及尺寸调控、着色剂的引入形式、包裹策略设计,以及宏观上降低硅酸锆合成温度、引入烧结致密化助剂等手段以提高包裹效果。最后指出C@ZrSiO4黑色色料在未来需要重点解决的一些问题。As a novel non-toxic and environmentally friendly black ceramic pigment,Zirconium silicate encapsulated carbon black(C@ZrSiO_(4))pigment has been receiving considerable attention in the field of inorganic ceramic pigment due to its excellent chemical stability,high temperature stability,and corrosion resistance for glaze melt.It is expected to replace the traditional spinel-based black pigments containing heavy metals(Ni,Cr and Co).However,carbon black still has some limitations and challenges relative to the industrial application,such as hard dispersion,easy agglomeration and low encapsulation rate due to rare function groups,which is difficult to combine with ZrSiO_(4).The influencing factors of inclusion process were analyzed based on model of the zircon-based encapsulation pigments.The improvement methods were presented,including the surface modification,size control of carbon black,broadening the carbon resource and inclusion strategy design.Meanwhile,reducing the synthesis temperature and adding the sintering densification agent were also efficient ways to improve encapsulation efficiency.Finally,some key problems to be solved in the future were also outlined.
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