电子设备耦合刚度对QFP器件振动可靠性的影响  

Effects of electronic equipment coupling stiffness on the reliability of the QFP component of an electronic equipment under vibration

作　　者：付永辉 王琼皎 董锋 刘江涛 FU Yonghui;WANG Qiongjiao;DONG Feng;LIU Jiangtao(Space Electronics Manufacturing Center Academy of Space Information Systems,Xi’an 710100,China)

机构地区：[1]空间电子信息技术研究院空间电子产品制造中心,西安710100

出　　处：《振动与冲击》2023年第22期204-209,311,共7页Journal of Vibration and Shock

摘　　要：电子设备内部模块间的互连耦合刚度对其动力学特性影响较大,首先研究了电子设备互连耦合状态下的隔振理论;然后以某电子设备中四角扁平封装(quad flat package,QFP)器件振动试验后引线断裂问题为例,开展了不同耦合状态下的理论分析,并通过有限元模态分析验证了该隔振理论的适用性;最后分析了QFP器件的振动响应,并基于Palmgren-Miner累积损伤理论,计算了不同耦合状态下的器件引线疲劳寿命,分析结果与产品环境试验符合性很好。The coupling stiffness between the internal modules of an electronic equipment has a great impact on its dynamic characteristics.First,the vibration isolation theory for the electronic equipment under the coupling condition was introduced.Then,taking the lead fracture of the quad flat package(QFP)component within an electronic equipment in vibration test as an example,the theoretical analyses of different coupling conditions were carried out,and availability of the vibration isolation theory was verified by the finite element modal analysis.Finally,the vibration response of the QFP component was analyzed,and the fatigue life of component lead under different coupling conditions were calculated based on Palmgren-Miner's cumulative damage theory.The analysis results are in good agreement with the product environmental test.

关 键 词：电子设备 耦合刚度 四角扁平封装(QFP)器件 疲劳寿命 

分 类 号：TB123[理学—工程力学]