有机硅基热界面材料的研究进展  

Research Progress of Silicone-Based Thermal Interface Materials

作　　者：韩蒙蒙 张阔 李敬 HAN Mengmeng;ZHANG Kuo;LI Jing(HL Mando(Beijing)Automotive System R&D Center Co.,Ltd.,Beijing 101500,China)

机构地区：[1]汉拿万都(北京)汽车部件研究开发中心有限公司,北京101500

出　　处：《有机硅材料》2023年第6期73-78,共6页Silicone Material

摘　　要：综述了使用陶瓷填料(如氮化硼、氧化铝等)提高有机硅基热界面材料(导热硅脂、导热硅橡胶垫片及导热硅凝胶)导热性能的研究进展。此外,还总结了导热硅脂、导热硅凝胶渗油性,导热硅橡胶垫片柔软性的研究进展。The research on the ceramic filler(such as boron nitride,alumina)to improve the thermal conductivity of silicone-based thermal interface materials(thermal conductive silicone grease,thermal conductive silicone rubber pad and thermal conductive silicone gel)has been described.In addition,the research progress on the oil permeability of thermal conductive silicone grease and thermal conductive silicone gel,and the flexibility of thermal conductive silicone rubber pad are also summarized.

关 键 词：热界面材料 导热 硅脂 硅橡胶 硅凝胶 陶瓷填料 

分 类 号：TQ264.17[化学工程—有机化工]