Fabrication of polyetheretherketone(PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method  

作　　者：Liexin Wu Li Meng Yueyue Wang Ming Lv Taoyuan Ouyang Yilin Wang Xiaoyan Zeng 

机构地区：[1]Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,People’s Republic of China

出　　处：《International Journal of Extreme Manufacturing》2023年第3期519-532,共14页极端制造（英文）

基　　金：supported by the National Natural Science Foundation of China(Grant No.51901082);the National Postdoctoral Program for Innovative Talents(BX20200137);the National Defense Basic Scientific Research Program of China(JCKY2018110C060)。

摘　　要：Additive manufacturing(AM)is a free-form technology that shows great potential in the integrated creation of three-dimensional(3D)electronics.However,the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature,high conductivity and high resolution remains a challenge.In this paper,a hybrid AM method combining the fused deposition modeling(FDM)and hydrophobic treatment assisted laser activation metallization(LAM)was proposed for manufacturing the polyetheretherketone(PEEK)-based 3D electronics,by which the conformal copper patterns were deposited on the 3D-printed PEEK parts,and the adhesion between them reached the 5B high level.Moreover,the 3D components could support the thermal cycling test from-55℃ to 125℃ for more than 100 cycles.Particularly,the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface,not affected by the inevitable printing borders and pores in the FDM-printed parts,then making the resolution of the electroless plated copper lines improved significantly.In consequence,Cu lines with width and spacing of only60μm and 100μm were obtained on both as-printed and after-polished PEEK substrates.Finally,the potential of this technique to fabricate 3D conformal electronics was demonstrated.

关 键 词：PEEK fused deposition modeling hydrophobic treatment laser activation metallization integrated manufacturing of 3D electronics RESOLUTION 

分 类 号：TG1[金属学及工艺—金属学]