PCB板过孔孔偏对过孔可靠性的影响与改善方法  

Impact of PCB Via Hole Misalignment on Via Hole Reliability and Improvement Methods

作　　者：魏凡智 于嘉成 杨昊昕 耶菲 WEI Fan-zhi;YU Jia-cheng;YANG Hao-xin;YE Fei(Xi′an Aeronautics Computing Technique Research Institute,AVIC,Xi′an 710000,China)

机构地区：[1]航空工业西安航空计算技术研究所,陕西西安710000

出　　处：《航空计算技术》2023年第6期115-118,共4页Aeronautical Computing Technique

基　　金：陕西省自然科学基础研究计划项目资助(2022JQ-564)。

摘　　要：过孔孔位偏移可能引起破盘,造成过孔孔壁镀铜附着力下降,同时会造成电流密度集中,影响过孔通流能力。针对PCB板过孔孔位偏移导致过孔环宽不足对过孔可靠性产生的影响进行分析,提出使用泪滴焊盘改善过孔环宽的不足,并通过数学模型计算出最佳泪滴焊盘尺寸。运用仿真软件进行参数化建模,对泪滴焊盘在过孔通流过程中的改善情况进行电流密度仿真,验证了泪滴焊盘对改善过孔孔位偏移带来的电流密度集中问题的有效性。Via hole misalignment in PCB can lead to pad breakage,a decrease in copper adhesion to the via hole walls,and the concentration of current density,affecting the via′s current-carrying capacity.This paper analyzes the impact of insufficient annular ring width caused by via hole misalignment in PCB on via hole reliability.It proposes the use of teardrop-shaped solder pads to enhance the annular ring width and calculates the optimal teardrop solder pad dimensions through mathematical modeling.Parametric modeling using simulation software assesses the improvement in current density during the via hole′s current-carrying process,validating the effectiveness of teardrop-shaped solder pads in mitigating current density concentration issues arising from via hole misalignment.

关 键 词：泪滴焊盘 过孔可靠性 孔位偏移 过孔环宽 

分 类 号：TN7[电子电信—电路与系统]