氧化铝填充树脂复合材料热导率的有限元模拟  

Finite element simulation of thermal conductivity of alumina filled resin composites

作　　者：范勇 孙迎新 FAN Yong;SUN Yingxin(Shanghai Allied Industrial Limited Company,Shanghai 200240,China;School of Chemical and Environmental Engineering,Shanghai Institute of Technology,Shanghai 201418,China)

机构地区：[1]上海阿莱德实业股份有限公司,上海200240 [2]上海应用技术大学化学与环境工程学院,上海201418

出　　处：《应用技术学报》2023年第4期328-332,共5页Journal of Technology

基　　金：上海应用技术大学校企合作基金(J2020-50)资助。

摘　　要：采用有限元数值模拟方法分析了氧化铝颗粒粒径、堆积密度以及颗粒级配对体系导热性能的影响。模拟结果显示,树脂基体条件下,氧化铝颗粒堆积密度<10%时,体系热导率低于0.5W/(m·K)。堆积密度较高时,例如氧化铝堆积密度>65%,体系热导率将>4.11 W/(m·K)。这是因为高密度堆积时,氧化铝颗粒之间由于界面接触容易形成一些导热通路,这将有利于热量的传输,而在低密度堆积时,颗粒之间被树脂填充,树脂的导热能力没有氧化铝强,传输热量速度慢,导致热导率较低。和树脂的热导率0.3 W/(m·K)相比,若体系需要较高的热导率,其中氧化铝的颗粒堆积密度需要达到60%以上才有实用价值。The influence of alumina particle size,packing density and particle size on the thermal conductivity of the system was analyzed by finite element numerical simulation.The simulation results show that the thermal conductivity of the system is lower than 0.5 W/(m·K)when the packing density of alumina particles is less than 10%under the resin matrix condition.When the packing density of alumina is higher than 65%,the thermal conductivity will be higher than 4.11 W/(m·K).This is because in high-density stacking,some thermal conduction paths are easily formed between alumina particles due to interface contact,which will be helpful to heat transmission.In low-density stacking,the particles are filled with resin.The thermal conductivity of resin is lower than alumina,and the heat transmission speed is slow.Compared with the thermal conductivity,0.3 W/(m·K),of the resin,if higher thermal conductivity is required,the packing density of alumina should be higher than 60%.

关 键 词：氧化铝颗粒 热导率 树脂基体 有限元数值模拟 

分 类 号：O64[理学—物理化学]