热压烧结温度对SiCp/Al复合材料性能的影响  

Influence of hot-pressed sintering temperature on properties of SiCp/Al composites

作　　者：蔡佳宁 乐晨 樊子民[1] 李鑫 唐明强 赵放 CAI Jianing;LE Chen;FAN Zimin;LI Xin;TANG Mingqiang;ZHAO Fang(College of Materials Science and Engineering,Xi’an University of Science and Technology,Xi’an 710000,China;TIZ Advanced Alloy Technology Co.,Ltd.,Quanzhou 362000,Fujian,China)

机构地区：[1]西安科技大学材料科学与工程学院,西安710000 [2]泉州天智合金材料科技有限公司,福建泉州362000

出　　处：《金刚石与磨料磨具工程》2023年第5期546-552,共7页Diamond & Abrasives Engineering

摘　　要：采用热压烧结法制备SiCp/Al复合材料,研究烧结温度对复合材料性能的影响。用X射线衍射、阿基米德排水法、三点弯曲法和扫描电镜分析复合材料样品的物相组成、相对密度、力学性能及微观形貌,并测定其热导率和热膨胀系数。结果表明:SiCp/Al复合材料由SiC、Al和Mg2Si相组成,加入Mg提高了基体和SiC颗粒之间的浸润性。随着烧结温度升高,复合材料的硬度和抗弯强度先增加后下降,在700℃时达到最大值98 HRB和275 MPa;复合材料的热导率先增加后下降,热膨胀系数先下降后增加,在700℃时分别达到最大值218.187 W/(m·K)和最小值8.6×10^(−6)K^(−1)。SiCp/Al composites were prepared by hot-pressing sintering method,and the effect of sintering temperature on the properties of the composites was studied.The phase compositions,relative density,mechanical properties and micro morphology of the composite samples were analyzed through X-ray diffraction,Archimedes drainage method,the three-point bending method and scanning electron microscope.Additionally,the thermal conductivity and thermal expansion coefficient were measured.The results show that SiCp/Al composites are composed of SiC,Al and Mg2Si phases.The addition of Mg improves the wettability between the matrix and SiC particles.With the increase of sintering temperature,the hardness and bending strength of the composites first increase and then decrease,reaching the maximum values of 98 HRB and 275 MPa at 700℃,respectively.The thermal conductivity of the composites first increases and then decreases,and the thermal expansion coefficient first decreases and then increases,reaching the maximum value of 218.187 W/(m·K)and the minimum value of 8.6×10^(−6)K^(−1)at 700℃,respectively.

关 键 词：SICP/AL复合材料 热压温度 力学性能 显微结构 热学性能 

分 类 号：TB333[一般工业技术—材料科学与工程]