导热聚酰亚胺及其复合材料的研究进展  

Research progress of thermally conductive polyimide and its composites

作　　者：凃思帆 杨丹妮 梁旭昀 钟荣健 胡德超 林静 TU Sifan;YANG Danni;LIANG Xuyun;ZHONG Rongjian;HU Dechao;LIN Jing(School of Materials Science and Hydrogen Energy,Foshan University,Foshan 528000,China;Key Lab of Guangdong High Property and Functional Macromolecular Materials,South China University of Technology,Guangzhou 510640,China;School of Applied Physics and Materials,Wuyi University,Jiangmen 529020,China)

机构地区：[1]佛山科学技术学院材料科学与氢能学院,佛山528000 [2]华南理工大学广东省高性能与功能高分子材料重点实验室,广州510640 [3]五邑大学应用物理与材料学院,江门529020

出　　处：《复合材料学报》2023年第11期6043-6060,共18页Acta Materiae Compositae Sinica

基　　金：广东省基础与应用基础研究基金(2021A1515110405);广东省高性能与功能高分子材料重点实验室开放基金(20220612,20220615);广东省大学生创新创业培训计划(S202211847048);佛山科学技术学院学术基金(xsjj202206zrb04,xsjj202206zrb05)。

摘　　要：随着电子设备朝着小型化、集成化和多功能化的趋势不断发展,实现电子材料的高导热性能对电子设备的稳定运行和使用寿命至关重要。聚酰亚胺(PI)因其优异的耐热性能和力学性能被广泛应用于热管理领域,然而传统PI的本征导热系数较低,难以满足电子器件的快速散热需求,发展新型高导热PI及PI复合材料成为目前国内外的研究重点。本文从PI分子链结构、分子链取向及分子间相互作用等方面阐述了非晶型与液晶型两类本征型导热PI的制备与性能调控,系统探讨了填料表面修饰、杂化改性、取向设计、三维网络构筑等方法对PI复合材料结构与性能的影响规律,最后对高导热PI及PI复合材料研究中面临的挑战进行了总结与展望。With the continuous development of electronic equipment towards miniaturization,integration and multifunction,the high thermal conductivity of electronic materials has become critically significant to ensure the stable operation and service life of electronic equipment.Polyimide(PI)is widely used in the thermal management field because of its excellent heat resistance and mechanical properties.However,the intrinsic thermal conductivity of traditional PI is low,which is difficult to meet the rapid heat dissipation requirements of electronic devices.The development of new highly thermally conductive PI and PI composites has become a research hotspot.This paper introduces the preparation and performance regulation of amorphous polyimides and liquid crystalline polyimides based on the molecular chain structure,molecular chain orientation and molecular interaction of intrinsic thermally conductive PI,and discusses the influence of surface modification,constructing hybrid fillers,orientation design,three-dimensional network structure on the structure and performance of PI composites.Finally,the challenges of highly thermally conductive PI and PI composites are summarized and prospected.

关 键 词：聚酰亚胺 导热性能 复合材料 本征导热 填料 结构设计 

分 类 号：TB332[一般工业技术—材料科学与工程]