染料JGB的镀铜机制及其对电解铜箔微观形貌和力学性能的影响  

Copper Plating Mechanism of Dye JGB and Its Effect on Microstructure and Mechanical Properties of Electrolytic Copper Foil

作　　者：陈杨 杜荣斌 朱旭 汪宏亮 杨林 桑风姣 CHEN Yang;DU Rongbin;ZHU Xu;WANG Hongliang;YANG Lin;SANG Fengjiao(College of Chemistry and Chemical Engineering,Anqing Normal University,Anqing 246133,China)

机构地区：[1]安庆师范大学化学与化工学院,安徽安庆246133

出　　处：《工业技术创新》2023年第5期93-98,共6页Industrial Technology Innovation

摘　　要：为研究染料健那绿B(JGB)的镀铜机制,考察其对电解铜箔微观形貌和机械力学性能等的影响,采用线性扫描伏安法(LSV)和计时电流法(CA),探讨JGB与聚丙二醇(PPG)、聚二硫二丙烷磺酸钠(SPS)、Cl-共存情况下对铜沉积的影响,同时利用X射线衍射仪(XRD)和扫描电子显微镜(SEM)分析晶面择优取向及铜箔形貌,并对电解铜箔进行表面粗糙度和力学性能测试。研究发现:在复合添加剂PPG、SPS、Cl-中加入JGB后,所得的铜镀层会更平整细致并保持良好的光泽度,且添加了15 mg/L JGB与未添加JGB相比,粗糙度下降20.79%,高温抗拉伸强度提升11.85%。In order to study the copper plating mechanism of dye Janus Green B(JGB)and its effect on the microstructure and mechanical properties of electrolytic copper foil,linear sweep voltammetry(LSV)and chronoamperometry(CA)were used to explore the influence of JGB on the copper deposition in the presence of polypropylene glycol(PPG),sodium polysulfide dipropane sulfonate(SPS)and Cr.Meanwhile,X-ray diffractometer(XRD)and scanning electron microscope(SEM)were used to analyze the preferred orientation of crystal plane and the morphology of copper foil,and the surface roughness and mechanical properties of electrolytic copper foil were tested.Findings:after adding JGB into composite additives PPG,SPS,CI,the obtained copper plate will be smoother,finer and keep good gloss.Its roughness will decrease by 20.79%and its tensile strength at high temperature will increase by 11.85%when adding 15mg/L of JGB.

关 键 词：健那绿B 染料 添加剂 聚丙二醇 择优取向 表面粗糙度 高温抗拉伸强度 

分 类 号：TQ153.14[化学工程—电化学工业]